High-purity Materials for Evaporation, Bonding, and Sealing

Joining Technology

High-purity Materials for Evaporation, Bonding, and Sealing

We offer a wide variety of high quality products.

Various bonding and sealing materials for precision parts, including evaporation materials for semiconductor devices are available.

Features

  • Gold and gold alloys are available in wire, ribbon, pellet, block, and ball forms.
  • Reduced trapped air and oxidized additives
Typical Compositions and Shapes
Item Shape
Wire Ribbon Pellet Block Ball
Au (99.99% , 99.999% )
AuSb1.0
AuZn5.0
AuSi3.15
AuBe1.0
AuGe12.5
AuSn20

Compositions other than listed those above are available
Composition range in between AuSn18 to AuSn30 is capable

Application

Die bonding, wafer evaporation, bonding, sealing, etc.

Gold alloy series

Au-Ge ball