TANAKA to Exhibit at SMAX2026 at Penang, Malaysia

Exhibition/Conference NEWS

July 16, 2026

TANAKA will be exhibiting at SMAX2026, which will take place from July 22nd to 24th, 2026, at Setia Spice Convention Center, Penang, Malaysia.

Booth Information
TANAKA-B181

At the exhibition, TANAKA will present a comprehensive range of precious metal materials and related technologies supporting the semiconductor industry across front-end, packaging, and testing processes. Exhibits will include bonding wires, silver adhesive pastes for die-bonding, AgSn TLP sheet, sputtering targets, probe pins materials, various plating technologies, and precious metal recovery and refining technologies.

We look forward to welcoming visitors to our booth (B181).

For more details on TANAKA products for the semiconductor industry, please refer to the URLs below:
Semiconductor Fabrication and TANAKA

For additional information and event details, please visit the official conference website:
https://smaxasia.com/