Press Release (for Korea); “First in the world, Tanaka Precious Metals, EEJA, establishes new electroplating solution for Palladium Bumping in substitution for Gold Bumpong in LCD-driver IC.”

Tokyo Japan – September 15, 2010 –
This content is released for Korea.

Tanaka Holdings Co., Ltd. announced that Electroplating Engineers of Japan, Limited (EEJA) began providing the MICROFAB Pd Series of neutral palladium plating solution for bump formation.

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