銅、銅合金鍵合線
降低線材成本的最佳選擇
提供無氧化物等級之高純度極細線徑銅(Cu)鍵合線(最小線徑15µm)。亦提供透過貴金屬電鍍做出耐氧化性能的Pd包覆銅鍵合線(PCC)。與昂貴的金(Au)鍵合線相比，有助於降低約90%的成本。
CFB-1 – 高純度Cu鍵合線
■特色
- 二焊點接合性優異, 容易設定參數
- 穏定的連續作業性
■Continuous Bonding 2nd Pull Test
CA-1 – 對應高信賴性的Cu合金鍵合線
■特色
- 優異的接合信賴性
- 寬廣的打線參數設定範圍(bonding process window)
- 低電阻
■Bond Reliability
![[Bond Reliability比較圖表]Bare Cu、CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block02_01.jpg)
■2nd Bond Process Window
![[2nd Bond Process Window比較]Bare Cu、CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block02_02.jpg)
CLR-1A – 高性能Cu鍵合線
■特色
- 優異且穩定的二焊點接合性
- 優異的接合信賴性
- 寬廣的打線參數設定範圍(bonding process window)
![[CLR-1A/Bare Cu/4N Au Wire的特性比較] Wire cost/Squashed ball rooundness/2nd bondability/Capillary life](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block03_01.jpg)
■FAB Shape and Roundness
■2nd Bondability
![[2nd Bondability]2nd Pull Strength比較圖表] CLR-1、Bare Cu](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block03_03.jpg)
■Reliability
![[Electrical resistance on uHAST比較圖表] CLR-1(Halogen)、Bare Cu(Halogen)、CLR-1(Green)、Bare Cu(Green)](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block03_05.jpg)
Storage Condition:130。C 85%
Failure ＝ΔR/R0>10%
Wire Diameter : 25μm
BGA Substrate（FR-4）
Mold resin : Conventional type
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