銅、銅合金鍵合線
降低線材成本的最佳選擇
提供無氧化物等級之高純度極細線徑銅(Cu)鍵合線(最小線徑15µm)。與昂貴的金(Au)鍵合線相比，有助於降低約90%的成本。
CFB-1 – 高純度Cu鍵合線
■特色
- 二焊點接合性優異, 容易設定參數
- 穏定的連續作業性
■Continuous Bonding 2nd Pull Test
CFB-1
Conventional
CA-1 – 對應高信賴性的Cu合金鍵合線
■特色
- 優異的接合信賴性
- 寬廣的打線參數設定範圍(bonding process window)
- 低電阻
■Bond Reliability
High Temperature Storage Test at 175℃
![[Bond Reliability比較圖表]Bare Cu、CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block02_01.jpg)
![[Bond Reliability比較圖表]Bare Cu、CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block02_02.jpg)
Bonding Cross Section at 1300 hrs
■2nd Bond Process Window
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![[2nd Bond Process Window比較]CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block02_03.jpg)
CA-1
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![[2nd Bond Process Window比較]Bare Cu](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/tw/products/images/b08-03/img_block02_04.jpg)
Bare Cu
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