NEWS
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Press ReleaseApplications for the Subjects of the "Precious Metals Research Grants" of Up to 5 Million Yen Open on September 1
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Press ReleaseTANAKA and MEMS CORE Conclude Joint Development Agreement and Commit to Technology Alliance Building a mounting center for MEMS patterning using low-temperature bonding material utilizing gold particl
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Press ReleaseElectroplating Engineers of Japan Commences Provision of Electroless Immersion Gold Plating Solution Enabling Plating on Semiconductor Package Substrates without Using Highly Toxic Cyanide Compounds
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Press ReleaseTANAKA Develops Silver Paste Able to Form Electronic Circuits Using UV Curing to Support Screen Printing
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Press ReleaseTanaka Precious Metals Announces Recipients of "Precious Metals Research Grants"
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Press ReleaseTanaka Precious Metals Commence Sales of Highly Electrically Conductive Silver Alloy Bonding Wire on January 15
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Press ReleaseTanaka Precious Metals, Newlong Seimitsu Kogyo and Taiyo Chemical Industry Commence to Provide Submicron Gold Particle Micro-composite Pattern Printing Technology on December 4
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Press ReleaseTanaka Precious Metals Succeeds in Recovery of Trace Amounts of Precious Metals by Detoxifying Cyanogen Plating Waste Liquid
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Press ReleaseTanaka Precious Metals Establishes a Local Subsidiary in Singapore and Commences Operation on October 1
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Press ReleaseApplications for the Subjects of the 2013 "Precious Metals Research Grants" Open on September 2
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Press ReleaseElectroplating Engineers of Japan (EEJA) has launched "POSFER-E series", which is compact, highly-functional and fully-automated electroplating semiconductor wafer equipment at a competitive price
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Press ReleaseTanaka Precious Metals First to Obtain ISO/IEC17025 Accreditation for Silver Analysis Technology in Japan
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Press ReleaseTanaka Precious Metals Records Highest Shipment Volume of Copper Bonding Wire in 2012 at Approximately Doubling the Previous Year's Volume
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Press ReleaseTanaka Precious Metals Announces Recipients of "Precious Metals Research Grants"
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Press ReleaseTanaka Precious Metals Commences Supply of Ultra-compact Crystal Oscillator Package Bonding Material Able to Halve Material Cost on March 22
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Press ReleaseTanaka Precious Metals Constructs Dedicated Plant for the Development and Manufacture of Fuel Cell Catalysts
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Press ReleaseTanaka Precious Metals Commences Providing Samples of High-performance Copper Bonding Wire and Silver Bonding Wire Aimed at Mass Production This Spring
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Press ReleaseTanaka Precious Metals Developes High-temperature Thermometer Wire Ten Times Conventional Strength - Samples Available from September 12
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Press ReleaseApplications for the Subjects of "Precious Metals Research Grants" Open on September 3
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Press ReleaseSouth Korean Heesung Metal Commences Production and Supply of Liquid Crystal Driver IC Plating Solution from Electroplating Engineers of Japan
The content of the press release are as detailed at the time of the announcement. Please contact us using the inquiry form to be updated on the current situation.