October 15,2021

TANAKA Kikinzoku Kogyo K.K.announced today that TANAKA has developed a Low-Temperature Sintering Nano-Silver Paste for Printed Wiring optimized for screen printing1 and current availability of samples.

This product enables miniaturization, and improved bending resistance of wiring, for use in screen printing, which is a mainstream printing method used in the field of printed electronics2. For this reason, it is expected to be widely used for flexible devices such as smartphones and wearable devices that need bending resistance, and for improving transparency in window defoggers and other products for which demand will grow as electric vehicles become more popular.

Enabling fine wire printing at 30 µm and less, with potential to further improve transparency and flexibility for electronic devices such as display devices and next-generation automotive window defoggers

20211015_TANAKA Develops Low-Temperature Sintering Nano-Silver Paste for Screen Printing.pdf