TANAKA Insights

Consumer Electronics
Semiconductor
Thin Films/Deposition

EDITOR`S PICKS: TANAKA Establishes Transfer Technology for its Sintered Gold Bonding Technology

Source: Semiconductor Digest Date: February 3, 2026 Written by: Semi...

2026/04/07

Medical
Medical Device Materials

MD&M West 2026 Booth Briefing—Silver-Based Materials for High-Precision, Minimally Invasive MedTech

This image is for illustrative purposes. Source: Machine Design Date: February 2, 2026 ...

2026/04/07

Consumer Electronics
Semiconductor
Joining and Sealing (Packaging)
Relays and Electrical Contacts

Material innovation: The new frontier of industrial automation

This image is for illustrative purposes. Source: Asia Pacific Metalworking Equ...

2026/04/07

Consumer Electronics
Semiconductor
Joining and Sealing (Packaging)
Relays and Electrical Contacts

“TANAKA's H. Ito, N. Abe, and S. Tejima on 'India's Semiconductor Ecosystem Gradually Surpassing China's'”

Source: Electronics For You BUSINESS – News

2026/01/13

Consumer Electronics
Semiconductor
Joining and Sealing (Packaging)
Relays and Electrical Contacts

TANAKA PRECIOUS METAL TECHNOLOGIES's Hybrid Sintering Reassesses the Reliability of SiC/GaN Power Modules

Source: Semiconductor Digest Date: December 12, 2025 Link:...

2025/12/25

Consumer Electronics
Semiconductor
Joining and Sealing (Packaging)
Relays and Electrical Contacts

[With a view to utilization in the increasingly popular photonics-electronics convergence] New ideas for next-generation high-density packaging that open up the possibilities of "gold"

TANAKA PRECIOUS METAL TECHNOLOGIES Kogyo, the "mediator" between heterogeneous chips and substrates, is a member of the semiconductor post-processing...

2025/12/15

Consumer Electronics
Semiconductor
Joining and Sealing (Packaging)
Relays and Electrical Contacts

[With a view to utilization in the increasingly popular photonics-electronics convergence] New ideas for next-generation high-density packaging that open up the possibilities of "gold"

Currently, in semiconductor back-end processes, the introduction of new technologies that are expected to be epoch-making, mainly in packaging technology, is being...

2025/12/15

Consumer Electronics
Semiconductor
Joining and Sealing (Packaging)
Relays and Electrical Contacts

【First-time Exhibitor at SEMICON India 2025】TANAKA to Make Inroads into Semiconductor Business with Deep Knowledge of Precious Metals! Supporting the Reliability of Bonding and Testing

TANAKA is strengthening its semiconductor-related business. Drawing on its expertise in precious metals developed through many years of experience, the Group is...

2025/12/15