TANAKA Establishes New Ruthenium Film Deposition Process That Contributes Toward Miniaturization and Improved Durability of Semiconductors
June 23, 2022
TANAKA Kikinzoku Kogyo K.K., which operates the TANAKA Precious Metals manufacturing business, announced today that TANAKA has established a two-stage film deposition process using the liquid ruthenium (Ru) precursor “TRuST.”
TRuST is a precursor that has excellent reactivity with both oxygen and hydrogen and can form high-quality ruthenium films. This process is a two-stage atomic layer deposition (ALD) process that uses hydrogen film formation to create a thin anti-oxidation film and oxygen for the deposition of a high-quality ruthenium film. It eradicates concerns that the substrate will become oxidized and, at the same time, can prevent the drop in ruthenium purity that occurs during hydrogen film deposition.
Prevents oxidation of substrates and achieves ultra-thin films of high quality and low resistance through a two-stage ALD process using the liquid ruthenium precursor “TRuST”; applications are expected in advanced technologies necessary for technological innovations such as data centers and IoT
20220623_TANAKA Establishes New Ruthenium Film Deposition Process That Contributes Toward Miniaturization and Improved Durability of Semiconduct