June 25,2023

EEJA Ltd., which operates TANAKA Precious Metals’ plating business, announced today that it would exhibit at the 37th INTERNEPCON JAPAN, the electronics packaging and manufacturing exhibition to be held at Tokyo Big Sight on January 25–27, 2023.

Exhibiting at INTERNEPCON JAPAN for the first time in four years, EEJA will premiere four new products related to plating technologies and processes. Together, they will help meet rising needs in the electronics industry, such as expanded data bandwidth in communications environments and improved durability of in-vehicle electronic components and semiconductors.

230125_EEJA (TANAKA Precious Metals) to Exhibit at 37th INTERNEPCON JAPAN.pdf