April 25, 2024

TANAKA will be exhibiting at SEMICON Southeast Asia 2024, which will take place from May 28th to 30th, 2024, at Malaysia International Trade and Exhibition Centre (MITEC), Kuala Lumpur, Malaysia. We will introduce our products, silver adhesives paste, bonding wires, brazing materials, and so on. Visit us at Booth 4031, Hall 5-7, level 2!

For additional information and event details, please visit the official conference website.
https://expo.semi.org/southeastasia2024/Public/enter.aspx/