Products Information
Throughout recent history, precious metals continue to provide profound support for industrial development,
TANAKA’s precious metal products realize that potential.
Search by Keyword
-
- Silver Adhesive Pastes for Die-bonding
- Thick Film Pastes and Precious Metal Powders
- Plating Processes
- Plating Equipment
- Gold-Tin Alloys for Brazing
- Precious Metals for Brazing Filler Metals
- Active Brazing Filler Metals
- AgSn TLP Sheet
- Sputtering Target Production Using Melting Methods and Vapor Deposition Materials
- High-purity Materials for Evaporation, Bonding, and Sealng
- Bumping Wires
- Bonding Wires
- Gold and Gold Alloy Bonding Wires
- Silver Alloy Bonding Wires
- Copper and Copper Alloy Bonding Wires
- Aluminum and Copper Bonding Wires for Power Devices
- Probe Pin Materials
-
- Electrocatalysts for Fuel Cell / Water Electrolysis (PEM type)
- Precious Metals Plating Electrodes (PEM Water Electrolysis GDL / Insoluble Electrodes)
- Reforming-, Shift-Reaction-, PROX Catalyst
- Exhaust Gas Purification Catalysts
- Carbon Recycling Catalysts
- Ammonia-Related Catalysts
- Hydrogen Permeable Films
- Platinum Gauze
-
- Precious Metal Powders for Pastes
- Sputtering Target Production Using Melting Methods and Vapor Deposition Materials
- Sputtering Target Production Using Sintering Methods
- Precious Metals Plating Electrodes (PEM Water Electrolysis GDL / Insoluble Electrodes)
- Plating Processes
- Plating Equipment
- CVD/ALD Precursors
- Nano-Silver Paste
-
- Electrical Contact Materials
- Rivet Contacts
- Micro Profiles (Contact Tapes)
- Contact Welding Process
- Precious Metal Clad Materials
- Precious Metal Spring Contacts
- Bumping Wires
- Bonding Wires
- Gold and Gold Alloy Bonding Wires
- Silver Alloy Bonding Wires
- Copper and Copper Alloy Bonding Wires
- Aluminum and Copper Bonding Wires for Power Devices
-
- Precious Metal Materials
- Silver Adhesive Pastes for Die-bonding
- Thick Film Pastes and Precious Metal Powders
- Gold-Tin Alloys for Brazing
- Precious Metals for Brazing Filler Metals
- Active Brazing Filler Metals
- AgSn TLP Sheet
- High-purity Materials for Evaporation, Bonding, and Sealng
- Platinum Clad Wires
- Low-temperature Sintering Paste for Au-Au Bonding: AuRoFUSE™
- AuRoFUSE™ Preforms