Packages and Sealing Semiconductor and Electronic Parts
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Silver Adhesive Pastes for Die-bonding
High Thermal Conductivity and High Reliability Ag Adhesive Pastes. Conductive adhesives for die bonding are used with Si for power devices and SiC and GaN next-generation semiconductors.
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Thick Film Pastes and Precious Metal Powders
We contribute toward better performance of electronic and sensor components and offer reliable quality.
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Plating Processes
We offer low-cost plating processes that meet the stringent requirements of a variety of applications.
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Plating Equipment
We offer high-performance plating equipment that supports cutting-edge plating technology.
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Gold-Tin Alloys for Brazing
Gold-tin brazing alloys for high reliability sealing / bonding.
Our gold-tin alloys are available in various shapes and sizes.
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Precious Metals for Brazing Filler Metals
We offer brazing filler metals of various alloys and shapes to suit your applications.
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Active Brazing Filler Metals
Our active brazing filler metals enable direct ceramic brazing.
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Sputtering Target Production Using Sintering Methods
Our sintering technology meets our customer’s expectations
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High-purity Materials for Evaporation, Bonding, and Sealing
We offer a wide variety of high quality products.
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Bumping Wires
Our bumping wire enables the formation of uniform and homogeneous bumps.
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Bonding Wires
We are the world’s largest provider of bonding wires, delivering optimum quality wires suitable for ICs and LSIs.
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Probe Pin Materials
Precious metal probe pin materials used in the inspection process of semiconductor manufacturing.