Joining Technology
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Precious Metal Materials
Precious Metals processed wider, thinner, longer and finer.
TANAKA offers a wide range of Precious metals products in various shapes and sizes.
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Silver Adhesive Pastes for Die-bonding
High Thermal Conductivity and High Reliability Ag Adhesive Pastes. Conductive adhesives for die bonding are used with Si for power devices and SiC and GaN next-generation semiconductors.
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Thick Film Pastes and Precious Metal Powders
We contribute toward better performance of electronic and sensor components and offer reliable quality.
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Gold-Tin Alloys for Brazing
Gold-tin brazing alloys for high reliability sealing / bonding.
Our gold-tin alloys are available in various shapes and sizes.
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Precious Metals for Brazing Filler Metals
We offer brazing filler metals of various alloys and shapes to suit your applications.
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Active Brazing Filler Metals
Our active brazing filler metals enable direct ceramic brazing.
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High-purity Materials for Evaporation, Bonding, and Sealing
We offer a wide variety of high quality products.
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Platinum Clad Wires
Our platinum clad wires take full advantage of the characteristics of platinum, such as tensile strength, heat resistance, corrosion resistance, oxidation resistance, etc.
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Low-Temperature Baked Paste for Au-Au Bonding AuRoFUSE™
Focusing on the low-temperature sintering properties of submicron gold particles.
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AuRoFUSE™ Preforms
A gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE™ low-temperature fired paste for gold-to-gold bonding