High-purity Materials for Evaporation, Joining and Sealing
What are "High-purity Materials for Evaporation, Joining, and Sealing"?
High-purity materials for vapor deposition, joining, and sealing are high-performance materials used in the manufacturing processes of electronic components and optical devices. They are used for forming thin metal films (vapor deposition), precision component bonding, and sealing, contributing to high reliability and longer lifespans. They play an important role in vacuum equipment and optical communication.
We offer a wide variety of high quality products.
Various bonding and sealing materials for precision parts, including evaporation materials for semiconductor devices are available.
We also have a lineup of SJeva, a high-quality Au deposition material with higher Au quality than earlier products. It contributes to higher productivity and lower costs for micro-wiring and medical equipment applications.
Overview of High-Purity Materials forEvaporation, Joining and Sealing
Features
- Can manufacture gold alloys inwire, ribbon, pellet, block, and spherical forms.
- Reduced trapped air and oxidized additives
| Types | Shape | ||||
|---|---|---|---|---|---|
| Wire | Ribbon | Pellet | Block | Sphere | |
| Au (purity 99.99% and 99.999%) | ○ | ○ | ○ | ○ | ─ |
| AuSb1.0 | ○ | ─ | ○ | ○ | ─ |
| AuZn5.0 | ○ | ─ | ○ | ○ | ─ |
| AuSi3.15 | ○ | ─ | ○ | ○ | ─ |
| AuBe1.0 | ─ | ─ | ○ | ─ | ─ |
| AuGe12.5 | ○ | ─ | ○ | ○ | ○ |
| AuSn20 | ○ | ○ | ○ | ─ | ○ |
- Compositions other than listed those above are available.
- AuSn deposition material can be manufactured with a wide composition range of AuSn from 18% to 30%.
Applications
Die bonding, wafer deposition, joining, and sealing, packaging, etc.
Gold alloy series
High-quality Au deposition material: Sjeva
Contributes to higher productivity and lower costs of products for semiconductors and medical equipment
Because it contains extremely few non-metallic inclusions compared to current products, it makes it possible to reduce the amount of precious metals used, increase productivity and cut costs by reducing processing, and raise recoverability and recyclability.
Features
- Oxides, sulfides, and other non-metallic materials present in the deposition material are reduced compared to earlier products
- Eliminates the need for a cleaning process due to reduced contaminants that collect on the surface during melting of the deposition material
- Shortens the preheating time before film formation and reduces the consumption of deposition material that does not contribute to film formation
- Reduces splash phenomenon from the deposition source during film formation, which reduces the number of particles that form on substrates during high-rate deposition
Contributes to higher end-user productivity and lower costs for micro-wiring and MEMS in the semiconductor fields as well as optical devices, LEDs, and medical equipment
SEM image
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