Plating Equipment

We offer high-performance plating equipment that supports cutting-edge plating technology.

We offer various types of wafer plating equipment in accordance with a customer’s needs, from mass-production systems to prototyping or low-volume production. Our comprehensive plating system focuses on compatibility with chemical processes and, with its high performance, is capable of coping with advancing technology such as wafers of increasing diameters and decreasing chip sizes.

Plating Equipment are products sold by Mitomo Semicon Engineering Co., Ltd., a member of TANAKA.
For more product details, click here (mitomo-semicon-eng.co.jp). link

Plating system for Wafer Processing

Compact, fully-automated system for mass production
POSFER E

Stir-cup equipped with paddle stirring mechanism inside cup
(Suitable for bumps, vias, rewiring, W-CSP and MEMS)
Wafer size : 100-200 mm

Plating system for prototyping and low-volume production

Semi-automated system for prototyping or low-volume production
Stir CUP-PLATER / CUP-PLATER

Systems available for prototyping to production on a mass scale
Semi-automatic type with high practicality and maintainability
Wafer Size:100-300 mm

Plating system for Wafer Processing

Full automated system for mass production
POSFER C/M

Fully automated system for single-and multi-layer plating
Designed for easy production scale-up
High operability with selectable automatic and manual modes
Wafer Size: 100-200 mm