Plating Processes

Precious Metal Film Formation Methods

Plating Processes

We can suggest high-performanceplating processes.

We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer highly productive plating processes with plating characteristics appropriate for their intended use.

Gold electroplating

PRECIOUSFAB Au series

The superior bondability, heat resistance, and solderability of this series make them ideal for semiconductor components. Excellent thickness uniformity at a low gold concentration, enabling reduced Au consumption.

PRECIOUSFAB Au-GB series

Gold electroplating process for wafer bumps. This series has excellent thickness uniformity, enabling plating with a high current density and low operation temperatures.

MICROFAB Au series

Non-cyanide Au plating for wafers. This series provides excellent properties for bump and fine pattern formation.

Process name Application Features
PRECIOUSFAB Au 8400 Bonding pad areas Good uniform electrodeposition, neutral cyanide
PRECIOUSFAB Au-MLA300 Low gold concentration, Ni elution prevention, neutral cyanide
PRECIOUSFAB Au-GB3 Wafers (bump) Low operation temperature, neutral cyanide
MICROFAB Au310 Wafers (wiring) Very fine surface roughness, neutral non-cyanide
MICROFAB AuFL2100 Low gold concentration、neutral non-cyanide
MICROFAB Au660 Wafers(bump) Low hardness, high-speed, neutral non-cyanide
MICROFAB Au3151 High hardness, high-speed, neutral non-cyanide

Gold alloy electroplating

PRECIOUSFAB HG series

Excellent electrical properties, abrasion resistance, corrosion resistance, and solderability. This series is suitable for connectors and other electronic components.

PRECIOUSFAB GT series

Electrolytic gold-tin alloy process. This series allows easy adjustment of alloy ratios, making it possible to adjust them according to their melting temperatures.

PRECIOUSFAB GS series

Electrolytic gold-silver alloy process. This series has both the corrosion resistance of gold and reflectivity of silver, making them ideal for LED components.

Process name Application Features
Au-Co PRECIOUSFAB HG-GVC Connectors, PWB Acidity cyanide
PRECIOUSFAB HG-ICC7 Ni barrier property, Acidity cyanide
Au-Ni PRECIOUSFAB HG-GVN Connectors, PWB Acidity cyanide
PRECIOUSFAB HG-ICN100 Ni barrier property, Acidity cyanide
Au-Sn20% PRECIOUSFAB GT1000 Alternative to coalescent Acidity cyanide
Au-Ag50% PRECIOUSFAB GS3000 Lead frames Alkali cyanide

Gold strike plating

PRECIOUSFAB Au-ST

With “Au-ST400” (Chlorine free), stainless steel can be plated directly in a strongly acid strike bath.

MICROFAB Au NX-ST

Non-cyanide type strike bath.

Process name Application Features
PRECIOUSFAB Au-ST100 General use Acidity cyanide
PRECIOUSFAB Au-ST400 SUS materials Chlorine-free, Strong acidity cyanide
MICROFAB Au NX-ST Wafer Neutral non-cyanide

Electroless gold plating

IM MEISTER Au series

Excellent adhesion and solder wettability on electroless Ni plating.
“IG100” develops uniform film thickness on Pd film.

CERAGOLD series

Self-reduction type thick Pb-free electroless gold plating process.

IM FAB Au-IG series

Non-cyanide electroless gold plating process applied to electrolytic and electroless Ni plating.

Process name Application Features
IM MEISTER Au1100S Bonding pad areas Immersion thin plating, cyanide
IM MEISTER AuFX5 Immersion thick plating, cyanide
IM MEISTER Au-IG100 Uniform immersion thick Pd plating, cyanide
IM MEISTER Au-IGS2020 Uniform immersion thick Pd plating, non-cyanide
CERAGOLD 6060 Ceramic parts, etc. Reduction thick plating, Pb-free, cyanide
IM FAB Au-IG7901 Wafers (bonding pad areas) Immersion thin plating, non-cyanide

Silver plating

PRECIOUSFAB Ag series

“Ag5” exhibits very bright surface, making this series ideal for LED components.
“Ag4730” is a mon-cyanide process developed for wafer use.

Process name Application Features
PRECIOUSFAB Ag5 General use Brightening agent, cyanide
PRECIOUSFAB Ag4370 Wafers Non-cyanide

Platinum group

PRECIOUSFAB Pd series

The “AD series” is a palladium plating process with less ammonia odor, which is friendly to the work environment and offers excellent corrosion resistance at high temperatures.

PRECIOUSFAB Pt series

Platinum plating process that enables thick plating with low stress and crackless.

PRECIOUSFAB Rh

Rhodium plating process that enables thick plating for industrial use.

Process name Application Features
Pd BELLPLATE Decorative articles White bright surface
PRECIOUSFAB Pd-LF5 Lead frames
(Pd-PPF)
Thin-film high heat resistance
PRECIOUSFAB Pd-ADG820 Thin-film high heat resistance, Neutral
PRECIOUSFAB Pd82GVE Connectors Pd-Ni 20% alloy
PRECIOUSFAB PC200 Pd-Co 20% alloy
MICROFAB Pd700 Wafers (bump) Neutral, thick plating
Pt PRECIOUSFAB Pt3LS Electronic components Acidity
PRECIOUSFAB Pt3000 Wafers Mild acidity
BELLPLATE Pt100 Decorative articles Thick plating
Rh PRECIOUSFAB Rh Electronic components High hardness
PRECIOUSFAB Rh2000 Decorative articles White surfaces
Ru PRECIOUSFAB Ru Electronic components High hardness
Ir PRECIOUSFAB Ir300