Plating Equipment

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What is "Plating Equipment"?
This equipment forms a uniform precious metal plating layer on the surface of semiconductor wafers to improve electrical properties and bonding reliability. This equipment supports cutting-edge surface treatment technology, which is essential for improving the performance of semiconductors and electronic components. We provide consistent support from process development to mass production operations.

We offer high-performance plating equipment that supports cutting-edge plating technology.

We offer various types of wafer plating equipment in accordance with a customer’s needs, from mass-production systems to prototyping or low-volume production.
Our comprehensive plating system focuses on compatibility with chemical processes and, with its high performance, is capable of coping with advancing technology such as wafers of increasing diameters and decreasing chip sizes.

Plating Equipment are products sold by Mitomo Semicon Engineering Co., Ltd., a member of TANAKA.
For product details, click here (mitomo-semicon-eng.co.jp).

Plating system for Wafer Processing

Compact, fully-automated system for mass production POSFER E

40% reduction in footprint (compared to TMG)
Stir-Cup equipped with paddle stirring mechanism inside cup
Wafer size: 100 to 200 mm

Plating system for prototyping and low-volume production

Semi-automated system for prototyping or low-volume production
Stir CUP-PLATER/CUP-PLATER

System development tailored to the application, from experimental prototypes to mass production.
Semi-automatic type with high practicality and maintainability
Wafer size: 100 to 300 mm