Plating Processes
What are "Plating Processes"?
This is a plating technology that can be used for a wide range of applications, including semiconductors, electronic components, and decorative items. We offer a lineup of processes that include a wide variety of plating chemicals such as pure gold, gold alloys, silver, and platinum group metals (Pd, Pt, etc.), and achieve functionality such as uniform electrodeposition, excellent heat resistance/corrosion resistance, and solderability. We can meet a variety of needs by offering comprehensive process proposals from process evaluation to mass production evaluation.
We offer highly-functional plating processes.
We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer highly productive plating processes with plating characteristics appropriate for their intended use.
Various plating processes are products sold by EEJA Ltd., a group company of TANAKA.
For product details, click here (eeja.com).
Gold Electroplating
PRECIOUSFAB Au series
Excellent bondability, heat resistance, and solderability of this series make them ideal for semiconductor components.
Excellent thickness uniformity at a low gold concentration, enabling reduced Au consumption.
PRECIOUSFAB Au-GB series
Gold electroplating process for wafer bumps.
This series has excellent thickness uniformity, enabling plating with a high current density and low operation temperatures.
MICROFAB Au series
Non-cyanide Au plating for wafers. This series provides excellent properties for bump and fine pattern formation.
| Product name | Applications | Features |
|---|---|---|
| PRECIOUSFAB Au8400 | Bonding PAD section | Good uniform electrodeposited film and neutral cyanide |
| PRECIOUSFAB Au-MLA300 | Low gold concentration, Ni elution prevention, Neutral cyanide | |
| PRECIOUSFAB Au-GB5 | Wafer (Bump) | Low operation temperature, Neutral cyanide |
| MICROFAB Au310 | Wafer (Wiring) | Very fine surface roughness, Neutral non-cyanide |
| MICROFAB AuFL2100 | Low gold concentration, Neutral non-cyanide | |
| MICROFAB Au660 | Wafer (Bump) | Low hardness, high-speed, Neutral non-cyanide |
| MICROFAB Au3151 | High hardness, high-speed, Neutral non-cyanide |
Gold Alloy Electroplating
PRECIOUSFAB HG Series
Excellent electrical properties, abrasion resistance, corrosion resistance, and solderability. This series is suitable for connectors and other electronic components.
PRECIOUSFAB GT Series
Electrolytic gold-tin alloy process. This series allows easy adjustment of alloy ratios, making it possible to adjust them according to their melting temperatures.
PRECIOUSFAB GS Series
Electrolytic gold-silver alloy process. This series has both the corrosion resistance of gold and reflectivity of silver, making them ideal for LED components.
| Product name | Applications | Features | |
|---|---|---|---|
| Au-Co | PRECIOUSFAB HG-GVC | Connectors, PWB | Acidic cyanide |
| PRECIOUSFAB HG-ICC7 | Ni barrier property, acidic cyanide | ||
| FINE BARRIER 7000 | Ni barrier property, acidic cyanide | ||
| Au-Ni | PRECIOUSFAB HG-GVN | Connectors, PWB | Acidic cyanide |
| PRECIOUSFAB HG-ICN100 | Ni barrier property, acidic cyanide | ||
| Au-Sn20% | PRECIOUSFAB GT1000 | Alternative to coalescent | Acidic cyanide |
| Au-Ag50% | PRECIOUSFAB GS3000 | Lead frames | Alkaline cyanide |
Gold Strike Plating
PRECIOUSFAB Au-ST
With “Au-ST400 (Chlorine free),” stainless steel and such in particular can be plated directly in a strongly acid strike bath.
MICROFAB Au NX-ST
Non-cyanide type strike bath.
| Product name | Applications | Features |
|---|---|---|
| PRECIOUSFAB Au-ST100 | General | Acidic cyanide |
| K-130AF | Acidic cyanide, Mildew-proofing | |
| PRECIOUSFAB Au-ST400 | SUS | Chlorine-free, Strong acidity cyanide |
| N-205 | High gloss, Strong acidity cyanide | |
| MICROFAB Au NX-ST | Wafer | Neutral non-cyanide |
Electroless Gold Plating
IM MEISTER Au series
Exhibits high adhesion and solder wettability on electroless nickel plating.
"IG100" also achieves uniform film thickness on palladium film.
CERAGOLD series
Self-reducing type lead-free thick electroless gold plating process.
SUPERMEX series
Non-cyanide electroless gold plating process applicable to electrolytic and electroless nickel films.
| Product name | Applications | Features |
|---|---|---|
| IM MEISTER Au1100S | Bonding PAD section | Immersion thin plating, Cyanide |
| IM MEISTER AuFX5 | Immersion thin plating, Cyanide | |
| IM MEISTER Au-IG100 | Uniform immersion thick Pd plating, Cyanide | |
| IM FAB Au-IGS2020 | Uniform thick Ni plating, immersion, non-cyanide | |
| ATOMEX | Ceramic parts, etc. | Immersion thin plating, Cyanide |
| CERAGOLD 6070 | Reduction thick plating, Pb-free, Cyanide | |
| SUPERMEX 250 | Wafer, General Purpose | Immersion thin plating, Non-cyanide |
| SUPERMEX 850 | Reduction thick plating, Non-cyanide |
Silver Plating
Cyanide type
| Product name | Applications | Features |
|---|---|---|
| Ag-10 | General | Hard and High cyanide |
| LED BRIGHT Ag-20 | LEDs and Others | Bright, high cyanide |
| SP-4000 | Lead frames | High current density compatibility, low cyanide |
Non-cyanide type
| Product name | Applications | Features |
|---|---|---|
| PRECIOUSFAB Ag4730 | Wafer | Non-Cyanide |
Platinum Group Metal (PGM) Plating
PRECIOUSFAB Pd series
The "AD series" are palladium plating processes that have very less ammonia odor, excellent corrosion resistance at high temperatures, and are considerate of the working environment.
PRECIOUSFAB Pt Series
Platinum plating process that allows thick plating without cracks at low stress.
PRECIOUSFAB's Rh, Ru, Ir
Plating processes for industrial and decorative use.
| Product name | Applications | Features | |
|---|---|---|---|
| Pd | PRECIOUSFAB Pd-ADP720 | Lead Frame (Pd-PPF) |
Thin-film high heat resistance |
| PRECIOUSFAB Pd-ADG860 | |||
| PRECIOUSFAB Pd82GVE | Connector | Pd-Ni 20% Alloy | |
| PRECIOUSFAB PC200 | Pd-Co 20% alloy | ||
| MICROFAB Pd700 | Wafer (Bump) | Neutral, thick plating | |
| Pt | PRECIOUSFAB Pt2000 | Electronic components, etc. | Acidic, high corrosion resistance |
| PRECIOUSFAB Pt-SF | Alkaline, thick film | ||
| Rh | PRECIOUSFAB Rh200 | Low stress, high hardness | |
| PRECIOUSFAB Rh2000 | High corrosion resistance and high hardness | ||
| Ru | PRECIOUSFAB Ru1000 | Acidic, low Ru concentration | |
| Ir | PRECIOUSFAB Ir300 | High Hardness | |
Application Examples (Power Device Modules)
Plating on Bonding Pads
| Part | Metals | |
|---|---|---|
| ① | Bonding Wires | Al, Au, Cu, PCC, Ag |
| ② | Plating on Bonding Pads | Ni/(Pd)/Au or Ag |
| Bonding Pad | Al, Cu |
We offer optimal plating conditions with excellent bondability in various combinations of Bonding wires and Bonding pads.
Ni/Au plating (Ni thickness: 5 μm / Au thickness: 0.05 μm)
Φ50μm pad
Ni/Pd/Au plating (Ni thickness: 5 μm / Pd thickness: 0.1 μm / Au thickness: 0.05 μm)
□100μm pad
- Limit corrosion and diffusion of Ni plating through the use of Pd plating
- Offer a comprehensive set of optimal processes, from the pretreatment conditions to the Au plating process
Rear-side electrodes for ohmic contacts
MICROFAB ELN520 – Plating process for ohmic contact on back of Si in vertical devices
- For Si backside ohmic contact of vertical devices including diodes
- Nickel silicide alloy layer is formed by sintering after directly electroless Ni plating to back side of Si.
Process for formation on back side of Si
| Process | Product name | |
|---|---|---|
| 1 | Pre-treatment | – |
| 2 | Catalyst activation | – |
| 3 | Electroless Nickel plating | MICROFAB ELN520 |
| 4 | Drying and Sintering | – |
| 5 | Electroless Gold Plating | IM FAB Au-IGS4200 |
- Ni deposit has low stress, possible to suppress wafer warpage after plating.
- By electroless Au plating on Ni, the die attach bondability is good.
Metallized layer for lead frames, copper clips, PCBs, etc.
TANAKA’s Pd plated coating has excellent barrier performance and can be expected to improve heat resistance property as a thin film.
Plating processes for Pd-PPF
*...Palladium Pre-Plated Frame
| Electrolytic Ni | GALVANOMEISTER Ni100 |
|---|---|
| Electrolytic Pd | PRECIOUSFAB Pd series |
| Electrolytic Au | POSTFLASH 100 |
Related Information
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