Precious Metal Clad Materials

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What is "Precious Metal Clad Materials"?
Functional Clad Material in which precious metals, including Ag-based alloys and Ag–metal oxide systems, are consequently bonded onto base materials such as copper, copper alloys, and iron-based alloys using TANAKA’s proprietary bonding technology. The technology enables the cladding of difficult-to-bond materials such as beryllium copper, as well as dissimilar metal combinations designed to utilize bimetal effects. The materials offer excellent flatness, sheet thicknesses down to 0.02 mm, and tight thickness tolerances of ±0.001 mm, supporting precision manufacturing and cost-efficient product development.

Multi-layer and multi-strip tapes available.
Width, thickness, and long-length formats can be customized according to customer specifications.

Precious metals clad on strips of copper and iron based alloys. Multi-layer and multi-strip tapes of variable widths and thicknesses are produced using TANAKA’s own unique continuous bonding process. These materials demonstrate the highest level of performance while utilizing a minimum amount of precious metals. Beryllium copper based tapes and solder clad materials are also available.

Precious Metal Clad Materials

Features

Available in a wide range of thicknesses, from 0.5 µm to 50% of total thickness.
High bonding strength allows a high degree of bending.
We supply a long length tapes with a high precision finish.

Dimensional precision

Total thickness (mm)	Dimensional Tolerance (mm)
Total thickness (mm)	Thickness	Width
Less than 0.05	±0.003	±0.05
0.05 to less than 0.10	±0.005	±0.05
0.10 to less than 0.30	±0.01	±0.1
0.30 to less than 0.60	±0.02	±0.15
0.60 to 1.00 or less	±0.03	±0.2

Cross-section of bond part

[Cross section of joint] Au alloy, Ag alloy, Cu alloy

Examples of material combinations

Precious Metal Materials	Base material	Shape	Total thickness (mm)	Total width (mm)	Cladding width (mm)	Cladding thickness ratio
AgPd AgPdCu SP-1 SP-2	C7701 GMX215 GMX96 CuNi20 C5212	1	0.025～0.5	7～30	0.5～5.0	1/20～1/2
AgCuNi CDF-2 AgNi	C1020 C2680 C5212	1	0.1～1.0	7～50	1.0～10.0	1/20～2/3
Ag Brazing Filler Matals	KOV	0	0.05～0.6	7～30	7～30	1/15～1/3

For shapes, “1” indicates an inlay type and “0” indicates an overlay type.
Please consult us regarding material, shape, and dimensions.

Illustration of width accuracy and thickness-to-width ratio — Width precision

W₁, W₂＝ ±0.3
Please consult us regarding measurement standards and tolerances.

Applications

Micro-motor brushes, commutator
Sensors, Switches, Relays, Connectors, etc.

Clad for Switch Contacts — <Clad for Sliding Contacts>

Clad for switching contacts — <Clad for Switching Contacts>

Thermal Dissipation Clad — <Clad for Heat Dissipation>

Types of Contact Materials

Main applications: Brush for Micro-motor, Sensors
Product name	Composition (wt%)					Vickers hardness (reference value)
Product name	Pt	Au	Ag	Pd	Others	Vickers hardness (reference value)
SP-1	10	10	30	35	Cu, others	270～360
SP-3	0.5	－	40	43	Cu	230～320
AgPd50	－	－	50	50	－	160～230
AgPd30	－	－	70	30	－	140～210

Main Applications: Micro-motor commutators, slide switches
Product name	Composition (wt%)					Vickers hardness (reference value)
Product name	Pt	Au	Ag	Pd	Others	Vickers hardness (reference value)
SP-2	5	70	10	－	Cu, others	170～210
CDF-2	－	－	92.5	－	Cu, others	120～170
AgCuNi	－	－	95.5	－	Cu, others	110～160
CDF-4	－	－	98.2	0.5	Cu, others	85～150

Type of Base Material

TANAKA provides clad products with a base material tailored to the application including C1020, C5210, C7701, CuNiSn alloys, BeCu, Kovar, and Corson alloys. Please inquire regarding combinations with bonding materials.

Please Inquiry

Please feel free Inquiry with any inquiries regarding products, media, competitive funding, etc.

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