Nano-Silver Paste

Consumer Electronics Sensor Materials Paste Compounds/Nanoparticles Semiconductors Joining and Sealing (Packaging) Powders, Compounds, Nanoparticles, and Pellet Thin Films/Deposition Electrochemical Electrodes

What is "Nano-Silver Paste"?
This conductive paste, containing dispersed fine silver nanoparticles, is a next-generation bonding material that can be used to form circuits and electrodes by printing. It sinters at low temperatures to achieve high conductivity, making it ideal for bonding and mounting power devices, sensors, and flexible electronic components.

Nano/submicron Ag paste with low-temperature sintering properties

Nano- and submicron-sized silver particles have the ability to sinter at low temperatures, and by turning them into a paste, it is possible to create printed circuits at low temperatures. This is particularly suitable for printing on organic substrates such as PET film, which cannot be sintered at high temperatures.

Features

It consists of Ag particles with an average particle size of about 120 nm, organic polymers, and organic solvents.
By curing (100℃~250℃) under air, low-resistance sintered Ag layer can be formed (refer to the figure below).
Wires of less than 100 µm can be printed by screen-printing.
Printed wiring has high durability against bending.
No change in resistance was observed even after bending 100,000 times with a bending radius of R = 0.5 mm.
(*Bending durability varies greatly depending on the base material.)