AgSn TLP Sheet
What is a "TLP sheet"?
This is an intermediate bonding sheet developed by TANAKA, primarily composed of Ni/Cu and manufactured using diffusion bonding technology. It enables bonding at 200 °C, maintains stability after subsequent high-temperature processes, and forms a thin bonding layer with reduced void formation. The material is suitable for high-reliability applications requiring thermal stability, including power devices and module assembly exposed to high heat loads.
Sheet bonding component that enables bonding of large silicon(Si)chips
A large area that supports a chip size of 20 mm with highly reliable bonding
Helps meet the growing need for high-power semiconductors in EV, HV, industrial infrastructure, and other applications.
TLP diffusion bonding：Transient Liquid Phase Diffusion Bonding(※1))
AgSn TLP Sheet Overview
Features
Reliability
- After bonding, Ag and Sn become Ag3Sn, which increases the heat resistance temperature to 480°C, providing higher heat resistance than existing materials.
- The bonding strength is maintained at a maximum of 50 MPa, and the same bonding strength is maintained even at 300°C.
- High bonding reliability that passed 3,000 cycles of heat cycle test.
Cost reduction
- Bonding can be completed in several minutes, which reduces the cycle time and therefore, reduces the process cost.
Reducing environmental impact
- The material is solvent-free and does not generate VOC (volatile organic compounds).
- Lead-free and does not contain substances restricted by the RoHS scope.
How to use
Bonding conditions
- Transient Liquid phase diffusion bonding(※1) is possible by heating temperature of 250℃.
- Bonding is possible with a low pressure of 3.3 MPa.
Bonding substrate
- Supports various substrates including Cu, Ni, and Ag.
Specifications
| Requirement | Performance |
|---|---|
| Applicable chip size | Up to 20 mm |
| Sheet Thickness | 0.03 to 0.2 mm |
| Bonding strength (shear strength) | 25 to 50 MPa |
| Heat resistance (high temperature shear strength 300℃) | 25 to 50 MPa |
| Reliability (HC -50℃⇔200℃) | 3,000 cycles |
| Bonded materials | Can bond Cu, Ni, and Ag |
(※1)Transient liquid phase diffusion bonding, also known as TLP bonding, is a bonding method that temporarily melts and liquifies metals and such inserted in the bonding surface, then uses diffusion to bond through isothermal solidification when carrying out diffusion bonding.
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