TANAKA will exhibit again PCIM Frankfurt in 2025!
TANAKA will exhibit at the PCIM to be held at Messe Frankfurt from May 6, 2025 to May 8.
(booth position: 4-132)
At this exhibition, TANAKA will introduce various products, technologies related power device using precious metals such as Aluminum Bonding Wires and Ribbons, Copper Bonding Wires and Ribbons, Hybrid Sintering Pastes and Pressure Sintering Pastes, AgSn TLP(Transient Liquid Phase diffusion bonding) Sheet, Active Brazing Filler Metal/Copper Composite Material and New Bonding Technology Based on Au Particles, AuRoFUSE Preform.
We look forward to your visit.
If you have any questions about the products, please book the business meeting.
We will accept business meeting reservations for the days.
Visitors are encouraged to visit the TANAKA booth (4-132).
Click here for booking the business meeting.
