Precious Metals in Front-End Process
① Front-End Process
Main Applications: Thin film formation, wiring materials, barrier layers
Ru precursors: Used in atomic layer deposition (ALD) for barrier layers and capacitors.
Ru sputtering targets: Used for thin film formation via sputtering.
Evaporation materials (e.g., Au, Pt, Pd): Used for high-purity metal film deposition.
Plating materials (e.g., Au, Ag, Pt): Used for fine wiring and bump formation.