Innovative direct patterning plating technology that opens up the potential of next-generation electronics

This technology does not require a vacuum environment or photoresist, and produces low-resistance fine wiring using a low-temperature process below 100°C.
It is possible to form directly on a wide variety of materials.
It is expected to open up new fields of next-generation electronics that could not be reached with existing metal wiring formation technologies.

Researchers and Developers

Masahiro Ito
EEJA General Affairs Department
Research and Development Department Chemical Section

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