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【Considering growing emerging trends toward Photonics-Electronics Integration technologies】Unlocking the possibilities of gold: New concepts for next-generation high-density packaging
Today, in semiconductor back-end processes, the introduction of epoch-making packaging technologies is accelerating. At the same time, there is growing expectation for the development of new materials with features and properties engineered to meet the requirements of these advancing innovations. TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. has developed AuRoFUSE™ preform, a new mounting solution that allows high-density packaging with high reliability.
In recent years, the semiconductor and electronics fields have demanded higher communication speeds, lower power consumption, and continued device miniaturization. Technologies gaining attention to meet these demands include three-dimensional packaging, which stacks components vertically, and high-density packaging, which integrates multiple functions within a limited footprint.
One of the key elements supporting these packaging technologies is flip-chip bonding. In this method, the chip is flipped upside down onto the substrate and directly bonded, the electrodes are connected using micro-bumps. Because the bonding material must satisfy a wide range of functional requirements—including appropriate bonding temperature, as well as sufficient electrical and thermal conductivity—material selection becomes critically important.
Issues faced in materials for bump formation
Currently, soldering and plating are primarily used to form bump electrodes.
Soldering offers the advantage of low cost and fast processing, but it raises concerns regarding short-circuit risks at fine pitches. In contrast, plating is well-suited for fine-wiring structures, yet the inherent hardness of the plated material makes it difficult to absorb variations in bump height or nonuniform loading. These limitations can lead to connection failures and the generation of residual strain.
To overcome these challenges, work is currently being undertaken vigorously to develop new materials and optimize the bonding process. Further evolution of high-density flip-chip bonding technology may be the key that supports next-generation semiconductor packaging.
NEXT ≫ “Mediator” between heterogeneous chips
and substrates
This is an excerpt from an advertisement article in “Nikkei xTECH” published on November 21, 2025, reproduced with permission from Nikkei Business Publications, Inc. (Unauthorized reproduction prohibited)
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