TANAKA Announces Merger of Plating Equipment Businesses
July 1, 2019
TANAKA KIKINZOKU KOGYO K.K.
TANAKA KIKINZOKU KOGYO K.K. announces that the plating equipment business division of its group company Electroplating Engineers of Japan Ltd. (EEJA) will be merged with group company Mitomo Semicon Engineering Co., Ltd. The move is intended to strengthen our business structure, further enhance our corporate value, and to offer improved services to customers.
[Business merger target]
Mitomo Semicon Engineering Co., Ltd.
25-3 Koshindaira, Bando-shi, Ibaraki, 306-0608, Japan