Gold and Gold Alloy Bonding Wires

Image of gold and gold alloy bonding wire products

More than 50 Years of Trust and Experience

What is "Gold and Gold Alloy Bonding Wires"?
Gold (Au) and gold alloy bonding wires with high performance continue to support the semiconductor industry. As conductive interconnection materials for reliably connecting semiconductor chips to electrodes, they offer excellent bondability, chemical stability, and high electrical conductivity. Through ongoing material development, functions such as fine-pitch bonding and low loop formation can be achieved while maintaining high purity, addressing diverse semiconductor packaging requirements worldwide.

Au
[Gold]

Au bonding wire that enables Stable Stitch Bond
GSA, GSB
Au bonding wire for Fine Pitch Bonding
GFC, GFD
High-reliability Au alloy bonding wires
GPH,GPG
Super Low Loop Au Bonding Wire
GLF
High-strength Au bonding wire
GMG,GMH-2

HAZ Length and Wire Breaking Load [Au Wire dia. 25um]

[HAZ Length and Breaking Load Comparison Graph] From left: Y/C/FA/GSA/M3/GHA-2/LC/GSB/GFC/GLF/GMH/GFD/GPH/GPG-3/GPG/GPG-2/GMG/GMH-2

GSA / GSB– Au bonding wires that enable for Stable Stitch Bond

Features

Stable stitch bond on QFN,QFP, BGA packages.
Good 2nd bond stitch remaining after pull test.
Good squashed ball shape and excellent FAB softness.

Stable Stitch Bond on QFN Packages (PPF, 175℃)

[Graph comparing Frequency and 2nd Pull Strength]Average-GSA:4.3gf/FA:4.1gf/GSB:4.2gf/GHM:4.0gf

After Stitch Pull Test

[After Stitch Pull Test]GSA/FA/GSB/GMH

Squashed Ball Roundness

[Comparison of Squashed Ball Roundness] GSA/GSB/FA/GMH

GFC / GFD- Au Bonding Wire for Fine Pitch Bonding

Features

Small deformation of squashed ball by ultrasonic frequency.
Wide actual bond area with suitable ultrasonic power.
Applicable for narrow pad pitch bonding.

Ball

[Ball Shape Comparison] GMH/GFC/GFD: 38-61µm, SBD: 45-75µm — Upper FAB : 38µm SBD : 45µm
Middle FAB : 51µm SBD : 60µm
Lower FAB : 62µm SBD : 75µm

35µm BPP Bonding

SEM image of 35µm BPP Bonding — Wire : GFC φ 15µm
Bonder : Shikawa UTC-3000
Pad Opening : 2µm

Scatter Diagram at 35µm BPP Bonding

Scatter Diagram at 35µm BPP Bonding-GFC

Scatter Diagram at 35µm BPP Bonding-GFD

Scatter Diagram at 35µm BPP Bonding-GMH

GPH - High Reliability Au Alloy Bonding Wire

Features

Higher bond reliability with halogen free compound

[Graph comparing Failure ratio and Aging time] GPH/GPG series

Comparison of Aging Time. GPH/GPG

GLF - Super Low Loop Au Bonding Wire

Features

Lower loop height than conventional low loop wires.
Less damage at neck region.
Suppression of snake-wire.
Higher pull load than conventional low loop wires.

Ball Shape SEM image of GLF

GMG – High Strength Au Bonding Wire

Features

High tensile strength wire enables cost reductions with finer diameters.
Applicable for multiple loop profiles used in BGA.
Excellent bump formation for a stack die package.

Mechanical Properties

[Graph comparing Breaking Load and Wire Diameter]FA/GMH/GMH-2/M3/GMG

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