Copper and Copper Alloy Bonding Wires
What are "Copper and Copper Alloy Bonding Wires"?
These bonding materials combine high conductivity with excellent cost performance, and is attracting attention as a replacement for gold wire. We offer products that take into consideration oxidation suppression and bonding stability, and are compatible with a variety of mounting processes and packages.
The best product to Cost Reduction
TANAKA offers high-purity copper (Cu) ultra-fine wires (down to 15 um) of oxygen-free copper grade. Costs can be reduced by approximately 90% compared to expensive gold (Au) wires.
CFB-1– Standard Bare Cu Wire
Features
- Excellent stitch bondability and wide bonding parameter window
- Stable and continuous bondability
Continuous Bonding 2nd Pull Test
CA-1– High Reliability Cu Alloy Bonding Wire
Features
- High bonding reliability
- Wide bonding window
- Low electrical resistivity
Bond Reliability
![[Bond Reliability Comparison Graph] Bare Cu/CA-1](/jp/products/img/img_bonding_wires_cu_15.jpg)
2nd Bond Process Window
![[Comparison of 2nd Bond Process Window]CA-1](/jp/products/img/img_bonding_wires_cu_17.jpg)
![[Comparison of 2nd Bond Process Window]Bare Cu](/jp/products/img/img_bonding_wires_cu_18.jpg)
Download Technical Data
Technical data can be downloaded from the banner below.
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