Aluminum and Copper Bonding Wires for Power Devices
What are "Aluminum and Copper Bonding Wires for Power Devices"?
Copper and copper alloy bonding wires are bonding materials used to electrically connect electrodes between semiconductor chips and substrates, and are attracting attention as an alternative to gold wires due to their high conductivity and cost benefits.We also offer palladium-coated copper (PCC) bonding wires, which offer bondability and bonding reliability while reducing costs.
The Standard for Power Devices
TANAKA ELECTRONICS offers high-purity aluminum (Al) and copper (Cu) bonding wires and ribbons with excellent surface properties of automotive grade. As aluminum has excellent corrosion resistance, it is often used in power device applications that drive high currents under harsh environments. TANAKA ELECTRONICS also offers wires for power devices with copper materials, which have even better electrical conductivity.
TANW – Aluminum Bonding Wire for Power Devices
Features
- Has a track record of many use cases in various power devices and modules such as IGBTs and MOSFETs
- Also used for connecting lithium-ion batteries of electric vehicles
- Has good bondability and excellent moisture resistance
- Available in various winding lengths from 50m to 1000m
Cross Section after Pressure Cooker Test
| Time (hrs) | |||
|---|---|---|---|
| 20 | 100 | 1000 | |
| TANW |  |
 |
 |
| Pure Al |  |
 |
|
Cross Section after PCT (Wire Dia.300µm)
PCT Condition : 121degC 100%RH 2atm
Wire Diameter
| Diameter | μm | 100 | 125 | 150 | 175 | 200 | 250 | 300 | 350 | 380 | 400 | 450 | 500 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mil | 4 | 5 | 6 | 7 | 8 | 10 | 12 | 14 | 15 | 16 | 18 | 20 |
TABR– Aluminum Bonding Ribbon for Power Devices
Features
- Used for connecting power devices and batteries
- Especially suitable for high-density devices that require low resistance, high current voltage, and high reliability.
- Has moisture resistance equivalent to TANW
- Stable bonding is possible due to smooth and clean surface
Cross Section Shape of TABR
Thickness: 0.2 mm
Ribbon Size
＊For other sizes, please Inquiry.
CP-1 – Copper Bonding Wire for Power Devices
Features
- Used for connecting power devices and batteries
- Especially suitable for devices that require low power loss and heat resistance
- Has excellent electrical conductivity and melting current because the material is copper
Electrical Resistance and Fusing Current
*Values are measured values and are not guaranteed values.
Wire Diameter
| Diameter | μm | 200 | 250 | 300 | 350 | 380 | 400 | 450 | 500 |
|---|---|---|---|---|---|---|---|---|---|
| mil | 8 | 10 | 12 | 14 | 15 | 16 | 18 | 20 |
Download Technical Data
Technical data can be downloaded from the banner below.
Related Information
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