Direct Patternable Plating Technology that
Opens the Potential of New-Generation Electronics
This technology does not require a vacuum environment or photo-resist,
and can directly form low-resistance fine wires on a variety of materials using a low-temperature process
that can be performed at or below 100°C.
As a result of the characteristics and benefits of this technology,
it is expected to open new areas of next generation electronics processes
that could not be achieved with existing metal wire forming technologies.
Masahiro ItoElectroplating Engineers of Japan Ltd.
Senior Technologist R&D Department