About Elements

Creating technology to support society
for a beautiful future

TANAKA is a precious metals specialist that excels at delivering innovation to the world that brings value to society. “Elements” is an online media circulated by TANAKA Precious Metals that focuses on technology and sustainability information in line with the business and values of the company. It provides hints for creating a better society and prosperous earth for the future in response to the rapid paradigm shift of the modern world.


A media for disseminating
information about technology to
support society for a beautiful future.

検索ボタン 検索ボタン

AI chip built using ancient Samsung tech is claimed to be as fast as Nvidia A100 GPU — prototype is smaller and much more power efficient but is it just too good to be true?

Share this article

AI chip built using ancient Samsung tech is claimed to be as fast as Nvidia A100 GPU — prototype is smaller and much more power efficient but is it just too good to be true?
Scientists from the Korea Advanced Institute of Science and Technology (KAIST) have unveiled an AI chip that they claim can match the speed of Nvidia’s A100 GPU but with a smaller size and significantly lower power consumption. The chip was developed using Samsung’s 28-nanometer manufacturing process, a technology considered relatively old in the fast-moving world of semiconductors.

The team, led by Professor Yoo Hoi-jun at KAIST’s processing-in-memory research center, has developed what it says is the world’s first ‘Complementary-Transformer’ (C-Transformer) AI chip. This neuromorphic computing system mimics the structure and workings of the human brain, using a deep learning model often employed in visual data processing.

“Neuromorphic computing is a technology that even companies like IBM and Intel have not been able to implement, and we are proud to be the first in the world to run the LLM with a low-power neuromorphic accelerator,” Yoo said.

Questions remain

This technology learns context and meaning by tracking relationships within data, such as words in a sentence, which is a key technology for generative AI services like ChatGPT. 

During a demonstration at the ICT ministry’s headquarters, team member Kim Sang-yeob showcased the chip’s capabilities. On a laptop equipped with the chip he performed tasks such as Q&A sessions, sentence summation, and translations using OpenAI’s LLM, GPT-2. The tasks were completed at least three times faster and, in some cases, up to nine times faster than when running GPT-2 on an internet-connected laptop. 

Implementing LLMs in generative AI tasks typically requires numerous GPUs and 250 watts of power, but the team claims their semiconductor uses only 1/625 of the power of Nvidia’s GPU for the same tasks. In addition, because it is also 1/41 of the size, measuring just 4.5mm by 4.5mm, it could ultimately be used in devices like mobile phones. 

Whether the chip can deliver on its promises in real-world applications remains to be seen, however. As Tom’s Hardware reports, “Though we are told that the KAIST C-Transformer chip can do the same LLM processing tasks as one of Nvidia’s beefy A100 GPUs, none of the press nor conference materials we have provided any direct comparative performance metrics. That’s a significant statistic, conspicuous by its absence, and the cynical would probably surmise that a performance comparison doesn’t do the C-Transformer any favors.“

This article was written by Wayne Williams from TechRadar and was legally licensed through the DiveMarketplace by Industry Dive. Please direct all licensing questions to

Related Information

Technology Trend and Advanced Packaging Material for Power Device 
Power device is key component for a wide range of applications such as smartphones, electronic devices, next-generation mobility including EV and HEV, cellular base stations, power control for renewable energy and so on. Its technology development is thriving day by day.
We introduce advanced packaging technology trends and cutting-edge materials designed to address challenges such as high heat dissipation, high heat resistance, reliable bonding in manufacturing, and miniaturization.

More information

  • TANAKA’s Initiatives for Power Devices
  • Aluminum and Copper Bonding Wires for Power Devices
  • Silver Adhesive Pastes for Die-bonding
  • Active Brazing Filler Metals