Copper and Copper Alloy Bonding Wires
The best product to reduce costs.
TANAKA offers high-purity copper (Cu) ultra-fine wires (down to 15um) of oxygen-free copper grade as well as palladium (Pd) coated copper wire (PCC) added with oxidation resistance through precious metal coating. Costs can be reduced by approximately 90% compared to expensive gold (Au) wires.
CFB-1 – Standard Bare Cu Wire
■Features
- Excellent stitch bond-ability and wide bonding parameter window
- Stable continuous bond-ability
■Continuous Bonding 2nd Pull Test
CA-1 – High Reliability Cu Alloy Bonding Wire
■Features
- Higher bond reliability
- Wider bonding window
- Lower resistivity
■Bond Reliability
![[Bond Reliability comparison graph] Bare Cu/CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-03/img_block02_01.jpg)
■2nd Bond Process Window
![[2nd Bond Process Window comparison] Bare Cu/CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-03/img_block02_02.jpg)
CLR-1A – High Performance Cu Bonding Wire
■Features
- High and stable bondability
- Excellent reliability
- Wide bonding window
■FAB Shape and Roundness
■2nd Bondability
![[2nd Bondability] 2nd Pull Strength comparison graph. CLR-1, Bare Cu](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-03/img_block03_03.jpg)
■Reliability
![[Comparison graph of Electrical resistance on uHAST] CLR-1(Halogen)/Bare Cu(Halogen)/CLR-1(Green)/Bare Cu(Green)](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-03/img_block03_05.jpg)
Storage Condition:130。C 85%
Failure ＝ΔR/R0>10%
Wire Diameter : 25µm
BGA Substrate（FR-4）
Mold resin : Conventional type
Technical Data Download
Technical data can be downloaded from the banner below.
