Copper and Copper Alloy Bonding Wires
The best product to reduce costs.
TANAKA offers high-purity copper (Cu) ultra-fine wires (down to 15 um) of oxygen-free copper grade. Costs can be reduced by approximately 90% compared to expensive gold (Au) wires.
CFB-1 – Standard Bare Cu Wire
■Features
- Excellent stitch bond-ability and wide bonding parameter window
- Stable continuous bond-ability
■Continuous Bonding 2nd Pull Test
CFB-1
Conventional
CA-1 – High Reliability Cu Alloy Bonding Wire
■Features
- Higher bond reliability
- Wider bonding window
- Lower resistivity
■Bond Reliability
High Temperature Storage Test at 175℃
![[Bond Reliability comparison graph] Bare Cu/CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-03/img_block02_01.jpg)
![[Bond Reliability comparison graph] Bare Cu/CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-03/img_block02_02.jpg)
Bonding Cross Section at 1300 hrs
■2nd Bond Process Window
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![[2nd Bond Process Window comparison] Bare CA-1](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-03/img_block02_03.jpg)
CA-1
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![[2nd Bond Process Window comparison] Bare Cu](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-03/img_block02_04.jpg)
Bare Cu
Technical Data Download
Technical data can be downloaded from the banner below.
