Aluminum and Copper Bonding Wires for Power Devices
The Standard for Power Devices
TANAKA Denshi Kogyo offers high-purity aluminum (Al) and copper (Cu) bonding wires and ribbons with excellent surface properties of automotive grade. As aluminum has excellent corrosion resistance , it is often used in power device applications that drive high currents under harsh environments. We also have wires for power devices that use copper, which has even better electrical conductivity.
TANW – Aluminum Bonding Wire for Power Devices
■Features
- Has a track record of many use cases in various power devices and modules such as IGBTs and MOSFETs
- Can also be used for connecting lithium-ion batteries of electric vehicles
- Has excellent bondability and moisture resistance
- Can be offered in rolls of various lengths from 50m to 1,000m
■Cross Section after Pressure Cooker Test
| Time (hrs.) | |||
|---|---|---|---|
| 20 | 100 | 1000 | |
| TANW |  |
 |
 |
| Pure Al |  |
 |
|
Cross Section after PCT (Wire Dia.300µm)
PCT Condition : 121degC 100%RH 2atm
■Wire Diameter
| Diameter | µm | 100 | 125 | 150 | 175 | 200 | 250 | 300 | 350 | 380 | 400 | 450 | 500 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mil | 4 | 5 | 6 | 7 | 8 | 10 | 12 | 14 | 15 | 16 | 18 | 20 |
TABN – Aluminum-Silicon-alloy bonding wire
■Features
- Uniform distribution of silicon
- Stable mechanical property
- Excellent corrosion resistance
■Si Distribution in Wire
![[Si Distribution in Wire]Upper : Homogeneous, Lower : Heterogeneous](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b08-04/img_block02_01.jpg)
■Loop Shape
COB
TABN Φ30µm SR type
DIP (Ceramics)
TABW Φ30µm SR type
TABR – Aluminum Bonding Ribbon for Power Devices
■Features
- Used for power devices and for connecting batteries
- Particularly suited for high power density devices that require low resistance, high current and voltage, and high reliability
- Has moisture resistance equal to TANW
- Smooth and clean surface allows stable bonding
■Cross Section Shape of TABR
Width : 2.0mm
Thickness : 0.2mm
■Ribbon Size
* Contact us for other sizes.
CP-1 – Copper Bonding Wire for Power Devices
■Features
- Used for connecting power devices and batteries
- Particularly suited for devices that require low electrical power loss and heat resistance
- Excellent electrical conductivity and fusing current value as the material is copper
■Electrical Resistance and Fusing Current
Fusing Current at 20mm (A)
* Values are measured values; they are not guaranteed values.
■Wire Diameter
| Diameter | µm | 200 | 250 | 300 | 350 | 380 | 400 | 450 | 500 |
|---|---|---|---|---|---|---|---|---|---|
| mil | 8 | 10 | 12 | 14 | 15 | 16 | 18 | 20 |
Technical Data Download
Technical data can be downloaded from the banner below.
