Aluminum and Copper Bonding Wires for Power Devices

Aluminum and Copper Bonding Wires for Power Devices

Aluminum and Copper Bonding Wires for Power Devices product image

The Standard for Power Devices

TANAKA Denshi Kogyo offers high-purity aluminum (Al) and copper (Cu) bonding wires (100 to 500µm) and ribbons (width 0.5 to 2.0mm) with excellent surface properties of automotive grade. As aluminum has excellent moisture resistance , it is often used in power device applications that drive high currents under harsh environments. We also have wires for power devices that use copper, which has even better electrical conductivity.

TANW – Al Bonding Wire for Power Devices

Features

  • Excellent corrosion resistance
  • Excellent bondability

Cross Section after PCT

[Comparison of Cross Section after PCT] TAWN/Pure AL - Wire Dia.:300µm PCT:at 121℃,100% RH,2atm

Long Winding Length

TAWN 400µm(#120K Spool) Winding Length:1,000m

TABN – Al-1%Si Bonding Wire

Features

  • Uniform distribution of Si
  • Stable mechanical property.
  • Good corrosion resistance under PCT.

Si Distribution in Wire

[Si Distribution in Wire]  Upper:Homogeneous,Lower:Heterogeneous

Loop Shape

Loop Shape-TABN φ30µm SR type,TABW φ30µm SR type

TABR -Al Bonding Ribbon for Power Devices

Features

  • Excellent corrosion resistance (Equal to TANW wire)
  • Corresponds to a multi size.
     Width  0.5mm~2.0mm
     Thickness 0.10mm~0.30mm
  • Satisfactory surface smoothness

TABR -Al Bonding Ribbon for Power Devices

Cross Section after PCT

[Cross Section after PCT-TABR] PCT Condition : 121degC 100%RH 2atm

Standard Size of TABR

Standard Size of TABR-Width:0.5±0.050~2.00±0.100mm,Thickness:0.10±0.010~0.30±0.030mm

CP-1 -Cu Heavy Bonding Wire for Power Device

Features

  • Excellent electrical conductivity (40% higher than Al)
  • High fusing current(30% higher than Al)
  • Available diameter(φ100~500μm)

CP-1 -Cu Heavy Bonding Wire for Power Device

Resistivity

[Comparison of Resistivity] Al wire / CP-1

Fusing Current

[Comparison graph of Fusing Current] Al wire / CP-1

Technical Data Download

Technical data can be downloaded from the banner below.

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About TANAKA Denshi Kogyo, Supporting the Semiconductor Industry

Creation of a New Business Starting From Bonding Wires

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