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Gold (Au) and gold alloy bonding wires with high performance continue to support the semiconductor industry.
Palladium (Pd) coated copper wire (PCC) added with oxidation resistance through precious metal coating.
High-purity aluminum (Al) bonding wires and ribbons with excellent surface properties.
TANAKA offers bonding thick wires (100 to 500µm) as metal bonding materials for power modules.
Conductive adhesives for die bonding are used with Si for power devices and SiC and GaN next-generation semiconductors. Our lineup includes hybrid types that allow a balance of high thermal conductivity and high reliability and sintering types with high thermal conductivity exceeding 200W/m･K.
Precious metal probe pin materials used in the inspection process of semiconductor manufacturing.
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TANAKA DIGITAL SHOWROOM
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Over 50 Years of Proven Expertise
Gold and gold alloy bonding wires offer remarkable stability and conductivity, supporting advanced semiconductor applications. Our material innovations enable fine pitch and low loop designs while maintaining high purity.
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Cost-Efficient Pd-Coated Copper Wire
TANAKA’s ultra-fine Pd-coated copper wire offers excellent oxidation resistance and cuts costs by up to 90% compared to gold wire.
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Al Bonding Wires for Power Devices
TANAKA provides high-purity aluminum bonding wires and ribbons with excellent surface quality, meeting automotive-grade standards. Their strong corrosion resistance makes them ideal for power modules operating under high current and harsh environmental conditions. For applications requiring even greater electrical conductivity.
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High-Purity Copper Bonding Wires for Cost-Sensitive Applications
TANAKA offers ultra-fine copper bonding wires (down to 15μm) made from oxygen-free, high-purity copper, as well as thicker wires (100–500μm) with automotive-grade surface quality for power modules. These wires provide excellent electrical performance and corrosion resistance, while enabling up to 90% cost reduction compared to gold wire.
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Ag Paste for Hybrid Sintering
[Features]
●Pressure-less sintering
●Excellent bonding to Cu
●Good reliability & High thermal conductivity
●RoHS Compliance & Pb solder replacement
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Precious metal probe pin materials used in the inspection process of semiconductor manufacturing.
A wide range of precious metal materials are available as probe pins for inspections conducted in the front-end and back-end processes of semiconductor manufacturing.
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