~Strengthening its capacity to produce aluminum bonding wires for power semiconductors~

January 12, 2022

TANAKA Denshi Kogyo to Establish New Plant in Kaohsiung, Taiwan ~Strengthening its capacity to produce high-performance copper bonding wires~

TANAKA Denshi Kogyo K.K. which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors. The plant is scheduled to commence operations in November of 2022.

Construction of this new plant forms part of TANAKA Denshi Kogyo’s plans to increase its production capacity for aluminum bonding wires by approximately three-fold by 2025 in order to meet the growing global demand associated with the growth of power semiconductors.

20220112_TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China ~Strengthening its capacity to produce aluminum bonding wires for power s.pdf