“TANAKA's H. Ito, N. Abe, and S. Tejima on 'India's semiconductor ecosystem gradually surpassing China's'”

Q. What are TANAKA's core services and areas of expertise?

A. We offer a variety of precious metal products, mainly for electronics and semiconductors. Platinum, gold, silver, palladium, iridium, and ruthenium are selected based on their excellent electrical conductivity, reliability, and stability. These precious metals are not merely decorative; they are essential in various fields, from chip packaging to automotive electronics.​​

For the semiconductor market, we have provided superior electrical performance and long-term reliability starting with ultra-pure materials, including gold wire with a purity of up to 99.99%. We have continued to evolve into a global leader in bonding wires for semiconductor packaging, not limiting ourselves to gold and expanding over the years into wires of copper, palladium-coated copper, silver, and aluminum.

Q. Why is the demand for these materials increasing in advanced electronics?

A. Advanced packaging technologies such as fine-pitch wire bonding and high-frequency chip integration require wires with clean surfaces and high electrical conductivity. Ultra-high-purity gold wire meets this requirement with minimal electrical resistance.

For power electronics, thicker aluminum and copper wires or ribbons are used. With a larger cross-sectional area, they offer excellent current capacity and improved heat resistance, making them essential for wide bandgap devices such as silicon carbide (SiC) and gallium nitride (GaN).

Meanwhile, advanced integration methods such as chiplets and 3D packaging rely on microbump and hybrid bonding for high-density interconnects, and our advanced plating processes ensure fine-pitch reliability and compatibility with a wide range of substrates. Furthermore, our silver adhesives complement these interconnect technologies, providing robust die attach and efficient heat dissipation to maintain reliability under thermal stress and meet the performance and reliability demands of next-generation devices.

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