Silver Adhesive Pastes for Die-bonding

Consumer Electronics Glass Melting Equipment Paste Semiconductor Joining and Sealing (Packaging) Joining materials Automotive Applications

What is "Silver Adhesive Pastes for Die-Bonding"?
Die-bonding refers to the process and materials used to attach semiconductor chips to substrates. Silver adhesive pastes are used for this bonding, exhibiting high thermal conductivity and reliability. They are used in fields such as next-generation power semiconductors and electric vehicles, where high heat resistance and performance are required. TANAKA offers a lineup of products that combine metal sintering and resin bonding using its proprietary hybrid technology to achieve stress relaxation and high bonding reliability.

Ag Adhesive Pastes with High Thermal Conductivity and High Reliability

Conductive adhesives for die bonding are used with Si for power devices and SiC and GaN next-generation semiconductors.
Our lineup includes hybrid types that allow a balance of high thermal conductivity and high reliability and sintering types with high thermal conductivity exceeding 200W/m･K.

Overview of Silver Adhesives for Die bonding

Features

High thermal conductivity silver adhesive paste lineup for various applications
Highly reliable, proven products for automotive applications
Alternative to high-temperature Pb solder pastes

Main product lineup

Product name	Type	Volume resistivity (µΩ･cm)	Thermal conductivity (W/m･K)	Features	Applications
TS-985シリーズ	Hybrid* Sintering	7	130－240	High thermal conductivity Alternative to solder High reliability	Automotive Power IC Power Module
TS-987シリーズ	Hybrid	5	160	High thermal conductivity Alternative to AuSn solder	LED Laser diode High-frequency module
TS-185シリーズ	Epoxy	10	80	High thermal conductivity High reliability	Automotive Power IC LED Laser diode
TS-333シリーズ	Thermoplastic	25	23	High thermal conductivity Low stress	Automotive Power IC
TS-175シリーズ	Epoxy	32	13	High thermal conductivity Low stress	Power IC RF Module Laser diode
TS-160シリーズ	Epoxy	200	2.5	High reliability	LED Laser diode Others