May 19, 2025

TANAKA will be exhibiting at SEMICON Southeast Asia 2025, which will take place from May 20th to 22th, 2025, at Expo and Convention Centre – Singapore.We will introduce our products,Aluminum Bonding Wires and Ribbons, Copper Bonding Wires and Ribbons, Hybrid Sintering Pastes and Pressure Sintering Pastes, AgSn TLP Sheet, Active Brazing Filler Metal/Copper Composite Material and Probe Pin Materials.Visit us at B2018 if you are there!

For additional information and event details, please visit the official conference website.
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