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Gold (Au) and gold alloy bonding wires with high performance continue to support the semiconductor industry.
Palladium (Pd) coated copper wire (PCC) added with oxidation resistance through precious metal coating.
TANAKA offers bonding thick wires (100 to 500µm) as metal bonding materials for power modules.
Conductive die-bonding adhesives for Si, SiC, and GaN devices. Our lineup includes hybrid types balancing thermal conductivity and reliability, and sintering types exceeding 200 W/m·K.
High-performance precious metal probe pin materials offering excellent conductivity and wear resistance for wafer and final semiconductor testing.
High-purity sputtering targets with fine microstructure for advanced semiconductor thin-film applications.
A wide range of high-quality precious metal compounds for plating and catalyst applications across various industrial fields.
Composite materials of copper and active brazing filler metals are used for applications such as ceramic circuit boards, and heat dissipation parts such as heat sinks, for power devices.
High-reliability AgSn TLP sheet for power semiconductor die attach, offering large-area bonding and excellent heat resistance.
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TANAKA DIGITAL SHOWROOM
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Over 50 Years of Proven Expertise
Gold and gold alloy bonding wires, offer remarkable stability and conductivity, supporting advanced semiconductor applications. Our material innovations enable fine pitch and low loop designs while maintaining high purity. They are manufactured at Tanaka Electronics Malaysia in Penang, ensuring stable supply and high manufacturing quality.
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Cost-Efficient Pd-Coated Copper Wire
TANAKA’s ultra-fine Pd-coated copper wire offers a good bondability, high reliability performance and significant cuts costs compared to gold wire.
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High-Purity Copper Bonding Wires for Cost-Sensitive Applications
TANAKA offers thick wires (100–500μm) with automotive-grade surface quality for power modules. These wires provide excellent electrical performance and corrosion resistance.
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Ag Paste for Hybrid Sintering
[Features]
●Pressure-less sintering
●Excellent bonding to Cu
●Good reliability & High thermal conductivity
●RoHS Compliance & Pb solder replacement
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Precious metal probe pin materials used in the inspection process of semiconductor manufacturing.
A wide range of precious metal materials are available as probe pins for inspections conducted in the front-end and back-end processes of semiconductor manufacturing.
Probe Pin Material Specifications
*1: Number of repeated bending tests until faliure with a wire diameter of 0.10 mm (according to in-house standard)
*2: Equivalent to ASTM B540
*3: Product covered by our patents
The above is an example, and we can accommodate compositions not listed, so please contact us for more information.
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High-purity Sputtering Targets
TANAKA’s high-purity sputtering targets deliver uniform thin-film deposition with controlled microstructure and excellent material consistency. With in-house refining and fabrication capabilities, we provide reliable solutions for advanced semiconductor and electronic applications.
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Comprehensive Precious Metal Chemistry Solutions
From basic salts to complex coordination compounds, TANAKA provides high-quality precious metal chemicals for plating and catalytic processes. Engineered for demanding industrial applications, our compounds ensure precise composition and consistent product quality.
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Active Brazing Filler Metal for Advanced Heat Dissipation
TANAKA has developed an Active Brazing Filler Metal / Copper Composite Material by cladding active brazing filler metal on copper (Cu), enabling direct bonding to ceramics and carbon materials without metallization. It enables thick copper electrode formation for high heat dissipation and finer wiring, while improving reliability with a solvent-free design. The material reduces cost through thinner brazing layers and simpler processing, and also contributes to lower environmental impact, supporting next-generation heat sinks and power device applications such as EVs, HVs, and high-power laser diodes.
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High-Reliability TLP Die Bonding Technology
TANAKA has developed AgSn TLP Sheet, a high-reliability die bonding material for power semiconductors, offering strong bonding performance and excellent heat resistance up to 480 °C. Its fast bonding process helps reduce production cost, while the solvent-free and lead-free design supports lower environmental impact.
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