AgSn TLP Sheet
Sheet bonding component that enables bonding of large silicon(Si)chips
A large area that supports a chip size of 20 mm with highly reliable bonding
Helps meet the growing need for high-power semiconductors in EV, HV, industrial infrastructure, and other applications.
TLP diffusion bonding,(※1)：Transient Liquid Phase Diffusion Bonding
AgSn TLP Sheet Overview
■Features
Reliability
- Ag and Sn form Ag3Sn after bonding, which increases the heat-resistant temperature to 480℃ and provides heat resistance higher than the existing material.
- The bonding strength stays at 50 MPa maximum, which is maintained even in 300℃.
- High bonding reliability that passed 3,000 cycles of heat cycle test.
Cost reduction
- Bonding can be completed in several minutes, which reduces the cycle time and therefore, reduces the process cost.
Reduction of environmental load
- The material is solvent-free and does not generate VOC (volatile organic compounds).
- Lead-free and does not contain substances restricted by the RoHS scope.
■How to Use
Bonding condition
- Transient Liquid phase diffusion bonding(*1) is possible by heating temperature of 250℃.
- Bonding is possible with low pressure of 3.3 MPa.
Bonding substrate
- Supports various substrates including Cu, Ni, and Ag.
■Specifications
| Requirement | Performance |
|---|---|
| Applicable chip size | Up to 20 mm |
| Sheet thickness | 0.03～0.2mm |
| Bonding strength (shear strength) |
25 to 50 MPa |
| Heat resistance (high-temperature shear strengthat 300℃) |
25 to 50 MPa |
| Reliability (H.C. -50℃ ⇔ 200℃) |
3,000 cycles |
| Bonded materials | Can bond |
- (※1)Transient liquid phase diffusion bonding, also known as TLP bonding, is a bonding method that temporarily melts and liquifies metals and such inserted in the bonding surface, then uses diffusion to bond through isothermal solidification when carrying out diffusion bonding.