Silver Adhesive Pastes for Die-bonding
High Thermal Conductivity and High Reliability Ag Adhesive Pastes
Conductive adhesives for die bonding are used with Si for power devices and SiC and GaN next-generation semiconductors. Our lineup includes hybrid types that allow a balance of high thermal conductivity and high reliability and sintering types with high thermal conductivity exceeding 200W/m・K.
Overview of Silver Adhesive Pastes for Die Bonding
■Features
- Lineup of silver adhesive pastes with high thermal conductivity for different uses
- Highly reliable automotive products with good records of performance
- Alternative to high-temperature Pb solder pastes
■Lineup of Major Products
Part No. | Type | Volume resistivity (µΩ・㎝) |
Thermal conductivity (W/m・K) |
Features | Use |
---|---|---|---|---|---|
TS-985 series | Hybrid* Sintering |
7 | 130-240 | Highly conductivity Alternative to solder High reliability |
Automotive power IC Power module |
TS-987 series | Hybrid | 5 | 160 | Highly conductivity Alternative to AuSn solder |
LED Laser diode High-frequency module |
TS-185 series | Epoxy | 10 | 80 | High conductivity High reliability |
Automotive power IC LED Laser diode |
TS-333 series | Thermo-plastic | 25 | 23 | High conductivity Low stress |
Automotive power IC |
TS-175 series | Epoxy | 32 | 13 | High conductivity Low stress |
Power IC RF module Laser diode |
TS-160 series | Epoxy | 200 | 2.5 | High reliability | LED Laser diode Other |
* Hybrid = sintering + resin bonding
TANAKA Original Hybrid Sintering
■Conceptual Images of Bonding
- TS-160 and TS-175 series
TS-185 and TS-333 series
Resin bonding - TS-985 series
TS-987 series
Sintering + resin bonding
= hybrid sintering - TS-985 series
Sintering
■Reliability and Features of Hybrid Sintering
-
Normal (hybrid) sintering structure
Very High Elastic modulus → High stress
-
TANAKA original hybrid sintering
Unique resin formulation → Lower stress
7x7mm Au sputtered chip/ Bare-CuLF (without mold resin)
Clack / delami length
TANAKA’s unique technology has realized good reliability.