Joining Technology
Active Brazing Filler Metals
Our active brazing filler metals enable direct ceramic brazing.
Our active brazing filler metals enable direct bonding of two ceramics, or ceramics to metals, regardless of whether they are oxides or nitrides, without metallization.
Features
- Enables direct bonding of ceramics without metalized layers
- Provides bonding strength equivalent to or higher than conventional methods
Types
| Product | Melting point | Form | ||
|---|---|---|---|---|
| TKC-661 | AgCuSnTi alloy | Approx. 780℃ | Sheet | Width: 110 mm or less Thickness: 0.05 mm or more |
| Diameter: 0.2 mm or more |
Active Metal Brazing Method
Adding active metals such as titanium to conventional brazing filler metals provides improved wettability and bonding strength. With active brazing filler metals, bonding can be performed with a single heating, enabling the work to be done with less man-hours and shorter lead times.
- Exterior of active brazing filler metal
- Exterior after active brazing filler metal has
been brazed
Applications
Bonding of ceramic jigs, engine components, electronic components for ceramic heat sinks, ceramic circuit boards, etc.
Enlarged photograph of the brazing layer
* Bonding conditions
Bonding should be carried out by conducting preplaced brazing under the following conditions:
In a vacuum of 1 x 10-3 Pa or less ; at a temperature of between 790 and 850°C; and with a melting time of 1 to 5 minutes
- For power semiconductors Active brazing filler metal / copper composite
After brazing of composite