Platinum Fine Wire Materials
Our reliable fine wire processing technology makes miniaturization, low power consumption, and other improvements with finer wires possible.
Fine platinum wires, known for their stable electrical and environmental properties, are widely used in various sensors, medical devices, and electrodes.
Features
- Ultra-fine wires are available (up to Φ10µm).
- Smooth and clean wire surfaces with excellent fine wire processing technology
- Fine wires of various platinum alloys and oxide dispersion strengthened platinum materials are available upon request.
| Materials | Melting point (℃) |
Density (g/cm3) |
Vickers hardness(HV) | Tensile strength (soft)(MPa) |
Resistance (soft) (µΩ･cm[20℃]) |
|
|---|---|---|---|---|---|---|
| Soft | Hard | |||||
| Pt-Rh5% | 1,818 | 20.80 | 70 | 160 | 225 | 17.5 |
| Pt-Rh10% | 1,850 | 20.10 | 90 | 190 | 284 | 19.2 |
| Pt-Rh20% | 1,885 | 18.80 | 100 | 220 | 394 | 20.8 |
| Pt-Ir5% | 1,790 | 21.50 | 90 | 140 | 274 | 19.0 |
| Pt-Ir10% | 1,800 | 21.60 | 130 | 230 | 382 | 24.5 |
| Pt-Ir20% | 1,840 | 21.70 | 200 | 300 | 539 | 32.0 |
| Pt-Ni10% | 1,580 | 18.80 | 150 | 320 | 441 | 32.0 |
| Pt-Ni20% | 1,450 | 16.80 | 220 | 400 | 588 | 34.1 |
| Pt-W8% | 1,850 | 21.27 | 200 | 360 | 588 | 62.0 |
For other materials, please contact us for further details.
* The property values are provided for reference purposes only and the adjustable range may vary depending on the shape. Therefore, please confirm when inquiring.
Applications
Sensors, including gas sensors, medical parts, electrodes, heaters, probe-pins, etc.
Prevents decrease in strength caused by crystal grain coarsening in high-temperature environments, increasing the range of applications in harsh temperature environments.
In high temperature environments, crystal grains become coarse, causing a significant decrease in strength. With nanoplat™, a strengthened platinum material with dispersed ZrO2 particles developed by TANAKA, the dispersed oxide particles work to hold the crystal grains together even at high temperatures, reducing the coarsening of the crystal grains and thereby preventing a decrease in strength and extending the lifespan.
Features
- Prevents crystal grain coarsening in high temperature environments and reduces strength loss
- Has the same electrical properties as the base Pt
Pt
Crystal grain coarsening in the heat-affected area
nanoplat™Series
Maintains processed structure
in heat-affected areas
| Product name |
Zr amount |
High heat strength |
Material strength |
Applicable wire diameter |
|
|---|---|---|---|---|---|
| nanoplat™BP | Pt | High | ◎ | ◎ | Φ250µm or above |
| nanoplat™TPW | Pt | High | ◎ | ◎ | Φ100µm or above |
| nanoplat™PW | Pt | Little | ○ | ○ | Φ15µm or above |
| nanoplat™APW | Pt | Little | ○ | ○ | Φ15 to 30µm |
nanoplat™BP
→For wire development of materials for platinum alloy equipment for glass manufacturing. Due to the presence of coarse oxide particles, can be used with wire diameters of Φ250µm and above.
nanoplat™TPW
→nanoplat™BP’s fine wire processing product. Fine oxide particles enable fine wire processing.
nanoplat™PW
→Although it has less strength due to the improvement of nanoplat™TPW’s thinning and reduction of Zr, it can be processed up to Φ15µm.
nanoplat™APW
→By adopting special coating technology, it provides low-cost support in the fine wire area.
*Contact TANAKA for features and required wire diameters other than those listed above