List of Types
|Thick Wire||Fine Wire||Coated Wire||Ribbon|
* Please inquire regarding product and development items for which detailed information is not provided on this site.
General guideline: Wire bondability by material
*Note: Bondability may depend on application. Please inquire for details.
Gold and Gold Alloy Bonding Wires
More than 50 Years of Trust and Experience
Gold (Au) and gold alloy bonding wires with high performance continue to support the semiconductor industry. They boast chemical stability and excellent electrical conductivity not found in other metals. Through material development, we can achieve functions such as fine pitch and low loop while maintaining high purity.
Silver Alloy Bonding Wires
Giving Form to the Technologies of a precious Metal Maker
Silver (Ag) alloy bonding wires have excellent electrical and thermal conductivity. They are also effective wires for optical semiconductor devices such as LEDs as they have high reflectivity in the visible spectrum. In addition, as an alternative material for gold (Au) wires, costs can be reduced by approximately 80%.
Copper and Copper Alloy Bonding Wires
The best product to reduce costs.
TANAKA offers high-purity copper (Cu) ultra-fine wires (down to 15um) of oxygen-free copper grade as well as palladium (Pd) coated copper wire (PCC) added with oxidation resistance through precious metal coating. Costs can be reduced by approximately 90% compared to expensive gold (Au) wires.
Aluminum and Copper Bonding Wires for Power Devices
The Standard for Power Devices
TANAKA Denshi Kogyo offers high-purity aluminum (Al) and copper (Cu) bonding wires (100 to 500µm) and ribbons (width 0.5 to 2.0mm) with excellent surface properties of automotive grade. As aluminum has excellent moisture resistance , it is often used in power device applications that drive high currents under harsh environments. We also have wires for power devices that use copper, which has even better electrical conductivity.
Stadards of Spool for Bonding Wire
For Fine Bonding Wire
For Wire and Ribon for Power Devices
*Please inquire about other specifications.
Physical Characteristics (data for use with simulations) * Reference values
|Density (20℃)||g･cm-3||19.32||8.92||2.70||10.50||12.02 (22℃)||21.45|
|Heat of fusion||kJ･mol-1||12.37||13.1||8.40±0.16||11±0.5||16.7||19.7|
|Thermal conductivity (0～100℃)||W･m-1･K-1||315.5||397||238||425||75.2||73.4|
|Specific heat (0～100℃)||J･kg-1･K--1||130||386.0||917||234||247||134.4|
|Coefficient of linear expansion (0～100℃)||x 10-6･K-1||14.1||17.0||23.5||19.1||11.0||9.0|
|Young’s modulus||GPa||88.3 (300K)||136 (298K)||69 (300K)||100.5 (300K)||121 (293K)||169.9 (293K)|