List of Types
|Thick Wire||Fine Wire||Coated Wire||Ribbon|
* Please inquire regarding product and development items for which detailed information is not provided on this site.
General guideline: Wire bondability by material
*Note: Bondability may depend on application. Please inquire for details.
Gold and Gold Alloy Bonding Wires
Silver Alloy Bonding Wires
Giving Form to the Technologies of a precious Metal Maker
Silver has the highest conductivity and thermal conductivity. But it easily become sulfurized and had a problem in durability. TANAKA Denshi Kogyo K.K. has solved these problems and is successfully marketing the results as commercial products. Silver materials are less expensive than gold materials, customers can reduce material costs by about 80%.
Copper and Copper Alloy Bonding Wires
The best product to reduce costs.
Copper and Copper Alloy Bonding Wires reduce costs approximately 90% compared to that of gold wires. In addition, these bonding wires feature excellent electrical characteristics including electrical conductivity and fusing current, making possible use in various devices including discrete semiconductors, QFP, and BGA. We also offer copper alloy wire and copper wire with a precious metal coating to enhance reliability.
Aluminum and Copper Bonding Wires for Power Devices
The Standard for Power Devices
Wires for power devices are required performance that can be used with high current flows under harsh environments. Being formed into thick wires(range of 100 to 500µm) or ribbons, aluminum, which have excellent bondability and corrosion resistance, is used widely in the field of power devices. We also have wires for power devices that use copper, which has excellent electrical conductivity.
Stadards of Spool for Bonding Wire
For Fine Bonding Wire
For Wire and Ribon for Power Devices
*Please inquire about other specifications.
Physical Characteristics (data for use with simulations) * Reference values
|Density (20℃)||g･cm-3||19.32||8.92||2.70||10.50||12.02 (22℃)||21.45|
|Heat of fusion||kJ･mol-1||12.37||13.1||8.40±0.16||11±0.5||16.7||19.7|
|Thermal conductivity (0～100℃)||W･m-1･K-1||315.5||397||238||425||75.2||73.4|
|Specific heat (0～100℃)||J･kg-1･K--1||130||386.0||917||234||247||134.4|
|Coefficient of linear expansion (0～100℃)||x 10-6･K-1||14.1||17.0||23.5||19.1||11.0||9.0|
|Young’s modulus||GPa||88.3 (300K)||136 (298K)||69 (300K)||100.5 (300K)||121 (293K)||169.9 (293K)|