Electrical Relay and Connection Technology
Bonding Wires
We are the world’s largest provider of bonding wires, delivering optimum quality wires suitable for ICs and LSIs.
Bonding wires are used for a wide range of products, such as ICs, LSIs and transistors. We bring you sound products at the cutting-edge of semiconductor technology.
Gold Bonding Wire
Features
Au wire
- Available with various types of package design such as DIP, SIP, QFP, BGA and FBGA.
- Available with the latest type of package such as stacked package and super thin package.
- Use of higher tensile strength wires enables cost reductions with finer diameters.
- Use of higher tensile strength wires enables use with fine pitch package.
Gold Bonding Wire Characteristics and Applications by Type
| Type | Product Specifications | Application | Feature | ||
|---|---|---|---|---|---|
| Breaking load (mN) |
Elongation (%) |
||||
| Au wire (Purity of 99.99%) |
Y | 34-65 | 2.0-5.0 | LED,TO,DIP,SIP | Excellent performance in thermal stress environment |
| GSA | 43-92 | 1.0-7.0 | QFN,QFP,DIP,SIP,CSP | Stable 2nd-bonding Fine pitch bonding |
|
| GSB | 51-99 | 1.0-7.0 | QFN,QFP,BGA,DIP,SIP,CSP | ||
| FA | 49-85 | 2.0-6.0 | DIP,SIP,QFP,BGA,CSP | Stable bonding | |
| GMG | 62-111 | 1.0-7.0 | DIP,SIP,QFP,BGA,CSP | Good for fine pitch small pads Good for long & short loops |
|
| GFC | 49-97 | 1.0-7.0 | Stable 1st-bonding Good for fine pitch small pads |
||
| GFD | 58-106 | 1.0-7.0 | |||
| GMH-2 | 66-114 | 1.0-7.0 | High strength with less wire sweep Fine pitch bonding |
||
| GLF | 55-103 | 2.0-7.0 | Less neck damage, good for fine pitch pads Good for super low loops |
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Short Loop Application
Long Loop Application
Gold Alloy Bonding Wire
Features
- Smaller squashed ball area
- Superior bonding reliability
- Can be used on conventional ball bonders
- No wire bonder stop and no drop of pull strength during continuous bonding
Aged at 200°C for 1000 hours
GPG，GPG-2
Au wire (Purity of 99.99%)
GPG · GPG-2 Types
Features
- High bonding reliability when combined with halogen resin
- Stable bonded ball shape. Good ball roundness (GPG-2)
GPH Types
Features
- High bonding reliability when combined with non-halogen resin
Gold Alloy Bonding Wire Characteristics and Applications by Type
| Type | Product Specifications | Application | Feature | ||
|---|---|---|---|---|---|
| Breaking load (mN) |
Elongation (%) |
||||
| Au alloy wire (Purity of 99%) |
GPG | 66-99 | 1.0-7.0 | DIP,SIP,QFP,BGA,CSP | High reliability with 99.99% Au wires, good for fine pitch pads Applicable to halogen resin |
| GPG-2 | 61-109 | 1.0-7.0 | |||
| GPH | 58-106 | 1.0-7.0 | High reliability with 99.99% Au wires, good for fine pitch pads Applicable to non-halogen resin |
||
Copper Bonding Wire
Features
- Enables a reduction in costs with a lower material cost than gold bonding wires
Size
- φ15μm～φ38μm
Comparison of Properties of Gold and Copper
| Physical Properties | Au | Cu |
|---|---|---|
| Resistivity:[µΩ · cm] | 2.3 | 1.7 |
| Thermal conductivity:[W/m · K] | 320 | 398 |
| Young’s modulus:[GPa] | 80 | 135 |
Cross-sectional Structure of the First Bonding Portion after a High Temperature Storage Test
- Voids due to Al intermetallic diffusion are unlikely to form.
*HTS conditions: Temp. 473K , Molded HF resin
Copper Bonding Wire Characteristics and Applications by Type
| Type | Product Specifications | Application | Feature | ||
|---|---|---|---|---|---|
| Breaking load (mN) |
Elongation (%) |
||||
| High Performance Cu | CLR-1A | 39-87 | 5.0-15.0 | QFN,QFP,BGA,CSP | High-performance copper wire Wide bonding window |
| Cu Alloy | CA-1 | 41-93 | 7.0-17.0 | QFN,QFP,BGA,CSP | High reliability, good for high 2nd-bonding |
| Bare Cu (Purity of 99.99%) |
CFB-1 | 43-94 | 7.0-17.0 | QFN,QFP,BGA,DIP,SIP,CSP | High 2nd-bonding Stable continuous bondability |
| TCA-1 | 42-90 | 5.0-15.0 | Good for fine pitch pads Stable ball formation |
||
| TCB-1 | 27-76 | 5.0-15.0 | Soft and stable ball formation | ||
Aluminum Bonding Wire
TANW Types
Features
- Excellent corrosion resistance
- Excellent bondability
Size
- Φ 100 to 500 µm
Aluminum wire
PCT：at 120℃, RH100%, 2atm
Aluminum Bonding Ribbon
TABR Types
Features
- Excellent corrosion resistance
(equivalent to TANW wire) - Available with multi-sizes
Size
- w0.5 to 2.0 mm、
t0.10mm～t0.30mm
*The winding length differs depending on the ribbon size.
Aluminum-Silicon Bonding Wire
TABN Types
Features
- Uniform Si distribution
- Stable mechanical properties
- Stable quality wire without any curl, dirt and surface flaws
- Excellent bondability
- Excellent corrosion resistance
Size
- Φ 18 to 80 µm
Aluminum-silicon wire
Silver Alloy Bonding Wire
SEA, SEB, SEC Types
Features
- Lower material costs than gold wire and higher bondability than copper wire
- High reflectivity in low wavelength region
Silver alloy wire
Reflectivity
Specific resistance
Technical Data Download
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