Bonding Wires
World’s Largest Provider(＊)
TANAKA’s Bonding Wires
As the top supplier of the ever-evolving semiconductor field, TANAKA brings you sound products.
- (＊)Source: SEMI Industry Research and Statistics/TECHCET, April 2020
List of Types
| Wire Type | |||||
|---|---|---|---|---|---|
| Thick Wire | Fine Wire | Coated Wire | Ribbon | ||
| Wire Material | Gold |  |
 |
 |
 |
| Silver |  |
 |
 |
 |
|
| Copper |  |
 |
 |
 |
|
| Aluminum |  |
 |
 |
 |
|
* Please inquire regarding product and development items for which detailed information is not provided on this site.
General guideline: Wire bondability by material
| Bonded Material | |||||||
|---|---|---|---|---|---|---|---|
| Al | Au/Pd/Ni Plating |
Ag Plating |
Au | Ni Plating |
Cu | ||
| Wire | Au/Au Alloy | ★★★ | ★★★ | ★★★ | ★★★ | ★☆☆ | ★★☆ |
| PCC | ★★★ | ★★☆ | ★★★ | ★★★ | ★☆☆ | ★☆☆ | |
| Cu/Cu Alloy | ★★★ | ★★☆ | ★★☆ | ★★★ | ★☆☆ | ★☆☆ | |
| Ag Alloy | ★★★ | ★★★ | ★★★ | ★★★ | ★☆☆ | ★★☆ | |
| Al | ★★★ | ★★☆ | ★★★ | ★★☆ | ★★★ | ★★★ | |
*Note: Bondability may depend on application. Please inquire for details.
Gold and Gold Alloy Bonding Wires
More than 50 Years of Trust and Experience
Gold and Gold Alloy Bonding Wires with high performance that have supported the semiconductor industry. Especially, the key feature is the outstanding performance of electrical conductivity, corrosion resistance, workability and chemical stability.
Silver Alloy Bonding Wires
Giving Form to the Technologies of a precious Metal Maker
Silver has the highest conductivity and thermal conductivity. But it easily become sulfurized and had a problem in durability. TANAKA Denshi Kogyo K.K. has solved these problems and is successfully marketing the results as commercial products. Silver materials are less expensive than gold materials, customers can reduce material costs by about 80%.
Copper and Copper Alloy Bonding Wires
The best product to reduce costs.
Copper and Copper Alloy Bonding Wires reduce costs approximately 90% compared to that of gold wires. In addition, these bonding wires feature excellent electrical characteristics including electrical conductivity and fusing current, making possible use in various devices including discrete semiconductors, QFP, and BGA. We also offer copper alloy wire and copper wire with a precious metal coating to enhance reliability.
Aluminum and Copper Bonding Wires for Power Devices
The Standard for Power Devices
Wires for power devices are required performance that can be used with high current flows under harsh environments. Being formed into thick wires(range of 100 to 500µm) or ribbons, aluminum, which have excellent bondability and corrosion resistance, is used widely in the field of power devices. We also have wires for power devices that use copper, which has excellent electrical conductivity.
Stadards of Spool for Bonding Wire
For Fine Bonding Wire
| Type | Material | A | B | C | D | E | F |
|---|---|---|---|---|---|---|---|
| AL-2 | Aluminum | 58.5 | 48.8 | 50.3 | 0.75 | 26.4 | 27.9 |
| AL-4 | 58.5 | 48.8 | 50.3 | 0.75 | 45.5 | 47 |
For Wire and Ribon for Power Devices
| Type | Material | A | B | C | D | E | F |
|---|---|---|---|---|---|---|---|
| No.88 | Poly Carbonate | 88 | 10 | 50 | 3 | 25 | 31 |
| No.88B | 89 | 10 | 71 | 3 | 25 | 31 | |
| No.88K | 88 | 11 | 50 | 3 | 31 | 37 | |
| No.120 | 120 | 10 | 54 | 4 | 30 | 38 | |
| No.120K | 120 | 11 | 64 | 4 | 30 | 38 |
Al-2
Al-4
No.88
No.88B
No.88K
No.120K
*Please inquire about other specifications.
Physical Characteristics (data for use with simulations) * Reference values
| Unit | Gold | Copper | Aluminum | Silver | Palladium | Platinum | |
|---|---|---|---|---|---|---|---|
| Atomic symbol | Au | Cu | Al | Ag | Pd | Pt | |
| Atomic number | 79 | 29 | 13 | 47 | 46 | 78 | |
| Atomic weight | 196.96655 | 63.546 | 26.981538 | 107.8682 | 106.42 | 195.078 | |
| Crystal structure | fcc | fcc | fcc | fcc | fcc | fcc | |
| Lattice constant | Å | 4.0785 | 3.6147 | 4.0496 | 4.0862 | 3.8907 | 3.924 |
| Melting point | K | 1336.15 | 1356.45±0.1 | 933.25 | 1233.95 | 1825.15 | 2042.15±1 |
| Boiling point | K | 2983 | 2855 | 2750±50 | 2423±20 | 3150±100 | 4100±100 |
| Density (20℃) | g･cm-3 | 19.32 | 8.92 | 2.70 | 10.50 | 12.02 (22℃) | 21.45 |
| Resistivity (20℃) | μΩ･cm | 2.3 | 1.694 | 2.7 | 1.63 | 10.8 | 10.58 |
| Heat of fusion | kJ･mol-1 | 12.37 | 13.1 | 8.40±0.16 | 11±0.5 | 16.7 | 19.7 |
| Thermal conductivity (0～100℃) | W･m-1･K-1 | 315.5 | 397 | 238 | 425 | 75.2 | 73.4 |
| Specific heat (0～100℃) | J･kg-1･K--1 | 130 | 386.0 | 917 | 234 | 247 | 134.4 |
| Coefficient of linear expansion (0～100℃) | x 10-6･K-1 | 14.1 | 17.0 | 23.5 | 19.1 | 11.0 | 9.0 |
| Young’s modulus | GPa | 88.3 (300K) | 136 (298K) | 69 (300K) | 100.5 (300K) | 121 (293K) | 169.9 (293K) |
| Shear modulus | GPa | 29.6 | 26.0 | 31.3 | |||
| Poisson’s ratio | 0.440 | 0.343 | 0.345 | 0.367 | 0.393 | 0.377 |
Technical Data Download
Technical data is provided upon request.
Please click below to enter required information.
