Platinum Fine Wire Materials

Equipment and Measuring Devices

Platinum Fine Wire Materials

Our reliable fine wire processing technology makes miniaturization, low power consumption, and other improvements with finer wires possible.

Fine platinum wires, known for their stable electrical and environmental properties, are widely used in various sensors, medical devices, and electrodes.

Features

  • Ultra-fine wires are available (up to Φ10µm).
  • Smooth and clean wire surfaces with excellent fine wire processing technology
  • Fine wires of various platinum alloys and oxide dispersion strengthened platinum materials are available upon request.
Characteristics of Typical Platinum and Platinum Alloy Materials (for reference)
 Materials  Melting point
(℃)
Density
(g/cm3)
Vickers hardness Tensile strength
(soft) (MPa)
Resistance (soft)
(µΩ・cm[20℃])
Soft Hard
Pt-Rh5% 1,818 20.80 70 160 225 17.5
Pt-Rh10% 1,850 20.10 90 190 284 19.2
Pt-Rh20% 1,885 18.80 100 220 394 20.8
Pt-Ir5% 1,790 21.50 90 140 274 19.0
Pt-Ir10% 1,800 21.60 130 230 382 24.5
Pt-Ir20% 1,840 21.70 200 300 539 32.0
Pt-Ni10% 1,580 18.80 150 320 441 32.0
Pt-Ni20% 1,450 16.80 220 400 588 34.1
Pt-W8% 1,850 21.27 200 360 588 62.0

For other materials, please contact us for further details.

* The property values are provided for reference purposes only and the adjustable range may vary depending on the shape. Therefore, please confirm when inquiring.

Applications

Sensors, including gas sensors, medical parts, electrodes, heaters, probe-pins, etc.

Prevents decrease in strength caused by crystal grain coarsening in high-temperature environments, increasing the range of applications in harsh temperature environments.

In high temperature environments, crystal grains become coarse, causing a significant decrease in strength. With nanoplat™, a strengthened platinum material with dispersed ZrO2 particles developed by TANAKA, the dispersed oxide particles work to hold the crystal grains together even at high temperatures, reducing the coarsening of the crystal grains and thereby preventing a decrease in strength and extending the lifespan.

Features

  • Prevents crystal grain coarsening in high temperature environments and reduces strength loss
  • Has the same electrical properties as the base Pt

Pt

  • Pt Cross-sectional diagram
  • Pt Cross-sectional diagram - details
    Crystal grain coarsening in the heat-affected area

nanoplat™Series

  • nanoplat®Series sectional view
  • nanoplat®Series sectional view - detials
    Maintains processed structure
    in heat-affected areas
Product name Composition Zr amount High heat strength Material strength Applicable wire diameter
nanoplat™BP Pt High Φ250µm or above
nanoplat™TPW Pt High Φ100µm or above
nanoplat™PW Pt Little Φ15µm or above
nanoplat™APW Pt Little Φ15 to 30µm

nanoplat™BP

→For wire development of materials for platinum alloy equipment for glass manufacturing. Due to the presence of coarse oxide particles, can be used with wire diameters of Φ250µm and above.

nanoplat™TPW

nanoplat™BP’s fine wire processing product. Fine oxide particles enable fine wire processing.

nanoplat™PW

→Although it has less strength due to the improvement of nanoplat™TPW’s thinning and reduction of Zr, it can be processed up to Φ15µm.

nanoplat™APW

→By adopting special coating technology, it provides low-cost support in the fine wire area.

*Contact TANAKA for features and required wire diameters other than those listed above

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