Electrical Relay and Connection Technology
Bumping Wires
Bumps can be formed with minimum variance in height.
Our bumping wires are available with bump formation methods for increasingly smaller, thinner, and higher-density electronics packaging. Bumps can be formed on semiconductor devices, such as ICs and LSIs, and other microelectronic devices at a lower cost and with a minimum variance in height.
Features
- Bumps can be formed with a minimum variance in neck height
- Bumps can be formed with a minimum variance in shape
- Suitable for small-volume production
Au Alloy Bumping Wire
GBC Type
Features
- In the high temperature storage test (200°C), the shear strength after bump formation, decreases less than other bumping wires (GBC)
Au Bumping Wire
GBE Type
Features
- Chips are not damaged during bump formation
![[Neck height comparison graph] GBC, GBE, LOw loop wire, Middle loop wire, High loop wire](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b07/img_gallery01_01.gif)
Neck Height
Bump Shape