Bumping Wires
Bumps can be formed with minimum variance in height.
Our bumping wires are available with bump formation methods for increasingly smaller, thinner, and higher-density electronics packaging. Bumps can be formed on semiconductor devices, such as ICs and LSIs, and other microelectronic devices at a lower cost and with a minimum variance in height.
Features
- Bumps can be formed with a minimum variance in neck height
- Bumps can be formed with a minimum variance in shape
- Suitable for small-volume production
Au Alloy Bumping Wire
GBC Type
Features
- In the high temperature storage test (200℃), the shear strength after bump formation, decreases less than other bumping wires (GBC)
Au Bumping Wire
GBE Type
Features
- Chips are not damaged during bump formation
Neck Height
![[Neck height comparison graph] GBC, GBE, LOw loop wire, Middle loop wire, High loop wire](https://prod-cms-cache-bucket.s3-ap-northeast-1.amazonaws.com/wp-content/uploads/sites/images/ex/en/products/images/b07/img_gallery01_01.gif)
Bump Shape
