TANAKA PRECIOUS METALS

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Electronic Mechancial Materials , Electronic Functional Materials(Relays,Motors,Switches)

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TOP > Products Information > Electrical Relay and Connection Technology

Electrical Relay and Connection Technology

Electrical Relay and Connection Technology

Electrical Contact Materials

We offer cadmium-free silver oxide contact materials for a wide range of applications.
Rivet Contacts

We offer rivet contacts of various materials and shapes to suit every need.
Micro Profiles (Contact Tapes)

Our Micro Profiles enable the miniaturization of relays and switches at a low cost.
Contact Welding Process

Our contact welding techniques enable welding of all types of contacts with a comprehensive system from prototyping to mass production.
Precious Metal Clad Materials

Multi-layer and multi-strip tapes available.
Your choice of width and thickness in long lengths.
Precious Metal Spring Contacts

Our precious metal spring contacts are available in fine patterns, which contributes to product miniaturization.
Bumping Wires

Our bumping wire enables the formation of uniform and homogeneous bumps.
Bonding Wires

We are the world’s largest provider of bonding wires, delivering optimum quality wires suitable for ICs and LSIs.

Product Information list

Recycling

Recovery and Refining
Recovery System for Precious Metals
Recycling of Spent Automotive and Petrochemical Catalysts
TANAKA Green Shield (method of recovering precious metals from vacuum film formation equipment components utilizing nickel plating)

Precious Metals Materials

Precious Metals Materials
Precious Metal Compounds
Precious Metal Powders for Pastes
Low-Temperature Baked Paste for Au-Au Bonding AuRoFUSE™
High-entropy alloy powder

Electronic Mechancial Materials , Electronic Functional Materials

Electrical Contact Materials
Rivet Contacts
Precious Metal Clad Materials
Micro Profiles (Contact Tapes)
Contact Welding Process
Precious Metal Spring Contacts
Automotive Materials Development

Packages and Sealing Semiconductor and Electronic Parts

Silver Adhesive Pastes for Die-bonding
Thick Film Pastes and Precious Metal Powders
Plating Processes
Plating Equipment
Gold-Tin Alloys for Brazing
Precious Metals for Brazing Filler Metals
Active Brazing Filler Metals
Sputtering Target Production Using Sintering Methods
High-purity Materials for Evaporation, Bonding, and Sealing
Bumping Wires
Bonding Wires
Gold and Gold Alloy Bonding Wires
Silver Alloy Bonding Wires
Copper and Copper Alloy Bonding Wires
Aluminum and Copper Bonding Wires for Power Devices
Probe Pin Materials

Sensor Materials

Thick Film Pastes and Precious Metal Powders
Precious Metal Spring Contacts
Platinum Fine Wire Materials
Platinum Clad Wires

Platinum Materials for the Glass Industry

Platinum Material for Glass Melting Equipment
Platinum Coating
Platinum Laboratory Instruments
Platinum Thermocouples

Carbon neutral (decarbonization), Energy, Environment

Electrocatalysts for Fuel Cell / Water Electrolysis (PEM type)
Precious Metals Plating Electrodes (PEM Water Electrolysis GDL / Insoluble Electrodes)
Reforming-, Shift-Reaction-, PROX Catalyst
Exhaust Gas Purification Catalysts
Carbon Recycling Catalysts
Ammonia-Related Catalysts
Hydrogen Permeable Films
Platinum Gauze

Medical

Gold Colloids
Diagnostics

Technology Development

Sputtering Target Production Using Sintering Methods
CVD/ALD Precursors
Precious Metals Nanoparticles
Nano-Silver Paste
AuRoFUSE™ Preforms

Precious Metal Film Formation Methods

Precious Metal Powders for Pastes
Sputtering Target Production Using Melting Methods and Vapor Deposition Materials
Sputtering Target Production Using Sintering Methods
Precious Metals Plating Electrodes (PEM Water Electrolysis GDL / Insoluble Electrodes)
Plating Processes
Plating Equipment
CVD/ALD Precursors
Nano-Silver Paste

Electrical Relay and Connection Technology

Electrical Contact Materials
Rivet Contacts
Micro Profiles (Contact Tapes)
Contact Welding Process
Precious Metal Clad Materials
Precious Metal Spring Contacts
Bumping Wires
Bonding Wires
Gold and Gold Alloy Bonding Wires
Silver Alloy Bonding Wires
Copper and Copper Alloy Bonding Wires
Aluminum and Copper Bonding Wires for Power Devices

Joining Technology

Sheets, Wires, Tubes, and Powders
Silver Adhesive Pastes for Die-bonding
Thick Film Pastes and Precious Metal Powders
Gold-Tin Alloys for Brazing
Precious Metals for Brazing Filler Metals
Active Brazing Filler Metals
High-purity Materials for Evaporation, Bonding, and Sealing
Platinum Clad Wires
Low-Temperature Baked Paste for Au-Au Bonding AuRoFUSE™
AuRoFUSE™ Preforms

Glass Melting / PGM Functional Materials

Platinum Material for Glass Melting Equipment
Platinum Coating
Platinum Laboratory Instruments
Platinum Thermocouples
Hydrogen Permeable Films
Platinum Gauze
Platinum Fine Wire Materials
Probe Pin Materials

Catalysts

Exhaust Gas Purification Catalysts
Reforming-, Shift-Reaction-, PROX Catalyst
Carbon Recycling Catalysts
Ammonia-Related Catalysts
Electrocatalysts for Fuel Cell / Water Electrolysis (PEM type)

Diagnostics

Gold Colloids
Diagnostics

Recovery and Refining

Recovery and Refining
Recovery System for Precious Metals
Recycling of Spent Automotive and Petrochemical Catalysts
TANAKA Green Shield (method of recovering precious metals from vacuum film formation equipment components utilizing nickel plating)

Compounds

Precious Metal Compounds
Precious Metals Nanoparticles
High-entropy alloy powder

About TANAKA

TANAKA's Strengths

TANAKA's Technologies

Company information

TANAKA in pictures

Proof of Trust and Reliability

History and development

Solutions

Products and Solutions

Products Information

NEWS/RELEASE

Precious metals library

TANAKA DIGITAL SHOWROOM

Precious Metal Elements

Elements

Tanaka Precious Metals Corporate Website

Proof of Trust and Reliability

Precious Metals Investment

Responsible Mineral Sourcing

Corporate Profile

Contact TANAKA for more information on products and case studies. Online enquiries 24 hours a day!

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