High-purity Materials for Evaporation, Bonding, and Sealing
We offer a wide variety of high quality products.
Various bonding and sealing materials for precision parts, including evaporation materials for semiconductor devices are available.
We also have a lineup of SJeva, a high-quality Au deposition material with higher Au quality than earlier products. It contributes to higher productivity and lower costs for micro-wiring and medical equipment applications.
High-purity Materials for Evaporation, Bonding, and Sealing Overview
Features
- Gold and gold alloys are available in wire, ribbon, pellet, block, and ball forms.
- Reduced trapped air and oxidized additives
| Item | Shape | ||||
|---|---|---|---|---|---|
| Wire | Ribbon | Pellet | Block | Ball | |
| Au (99.99% , 99.999% ) | ○ | ○ | ○ | ○ | ─ |
| AuSb1.0 | ○ | ─ | ○ | ○ | ─ |
| AuZn5.0 | ○ | ─ | ○ | ○ | ─ |
| AuSi3.15 | ○ | ─ | ○ | ○ | ─ |
| AuBe1.0 | ─ | ─ | ○ | ─ | ─ |
| AuGe12.5 | ○ | ─ | ○ | ○ | ○ |
| AuSn20 | ○ | ○ | ○ | ─ | ○ |
・Compositions other than listed those above are available.
・AuSn deposition materials can be manufactured in a wide composition range of AuSn18% to 30%.
Application
Die bonding, wafer evaporation, bonding, sealing, etc.
Gold alloy series
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Wire
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Ribbon
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Pellet
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Block
Au-Ge ball
High-quality Au deposition material: Sjeva
SJeva (granules)
Contributes to higher productivity and lower costs of products for semiconductors and medical equipment
Because it contains extremely few non-metallic inclusions compared to current products, it makes it possible to reduce the amount of precious metals used, increase productivity and cut costs by reducing processing, and raise recoverability and recyclability.
■Features
- Oxides, sulfides, and other non-metallic materials present in the deposition material are reduced compared to earlier products
- Eliminates the need for a cleaning process due to reduced contaminants that collect on the surface during melting of the deposition material
- Shortens the preheating time before film formation and reduces the consumption of deposition material that does not contribute to film formation
- Reduces splash phenomenon from the deposition source during film formation, which reduces the number of particles that form on substrates during high-rate deposition
Contributes to higher end-user productivity and lower costs for micro-wiring and MEMS in the semiconductor fields as well as optical devices, LEDs, and medical equipment
SEM photo
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Before melting
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After melting
