Joining Technology
High-purity Materials for Evaporation, Bonding, and Sealing
We offer a wide variety of high quality products.
Various bonding and sealing materials for precision parts, including evaporation materials for semiconductor devices are available.
Features
- Gold and gold alloys are available in wire, ribbon, pellet, block, and ball forms.
- Reduced trapped air and oxidized additives
| Item | Shape | ||||
|---|---|---|---|---|---|
| Wire | Ribbon | Pellet | Block | Ball | |
| Au (99.99% , 99.999% ) | ○ | ○ | ○ | ○ | ─ |
| AuSb1.0 | ○ | ─ | ○ | ○ | ─ |
| AuZn5.0 | ○ | ─ | ○ | ○ | ─ |
| AuSi3.15 | ○ | ─ | ○ | ○ | ─ |
| AuBe1.0 | ─ | ─ | ○ | ─ | ─ |
| AuGe12.5 | ○ | ─ | ○ | ○ | ○ |
| AuSn20 | ○ | ○ | ○ | ─ | ○ |
Compositions other than listed those above are available
Composition range in between AuSn18 to AuSn30 is capable
Application
Die bonding, wafer evaporation, bonding, sealing, etc.
Gold alloy series
Au-Ge ball
New product “SJeva”
- Newly developed high-quality Au deposition material
- Reduces the amount of non-metallic inclusions in a product
- Given of extremely low level of non-metallic inclusions, contaminants that collect on the surface during melting of the deposition material are reduced, eliminating the need for cleaning.
SJeva (granules)